Silicon wafer cutter correction process
A cutting knife and wafer technology, which is applied in the field of silicon wafer wafer cutting knife correction technology, can solve problems such as cutting tool errors, reduce the possibility of becoming waste products, and simplify the operation process
Inactive Publication Date: 2018-04-13
江阴苏阳电子股份有限公司
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AI Technical Summary
Problems solved by technology
[0004] During the cutting process, the tool sometimes has a cutting error due to the negligence of the staff and needs to be corrected. There is no such correction process in the existing process
Method used
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Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0016] The present invention mainly aims at the chip loading process in the chip packaging process, and provides a silicon wafer cutter correction process, the specific steps are as follows:
[0017] Step 1. Correction of cutting position: During the cutting process, press the "START / STOP" key, the machine will pause the cutting, move the working disc under the microscope, and the correction interface will appear, use the Y∧ or Y∧ key to adjust the reference line to the cutting area. Match; press the F5 key, the machine will correct the deviation between the cutting mark and the position of the cutting area; press the "START / STOP" key, the machine will start cutting again, and then press the "START / STOP" key to check whether the correction is accurate, and continue to correct if necessary , repeat the above process, press the "START / STOP" button, the machine starts cutting again;
[0018] Step 2. Cutter replacement: In the main menu interface, press the F5 key to enter the "Bl...
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The invention relates to a silicon wafer cutter correction process. The silicon wafer cutter correction process comprises the following steps of 1, cutting position correction, in which a machine canstop cutting by pressing a START / STOP key during the cutting process, a working disc moves to a part under a microscope, a correction interface occurs, a reference line and a cutting region are adjusted to be coincided by Y Lambda or a Y Lambda key, the machine can be used for correcting deviation between a cutting line and the cutting region by pressing an F5 key, the machine can begin to cut again by pressing the START / STOP key, whether correction is accurate or not is detected by pressing the START / STOP key again, the process is repeated if the correction is needed to be continued, and themachine begins to cut again by pressing the START / STOP key; 2, cutter replacement; and 3, cutting speed correction. According to the silicon wafer cutter correction process, the cutter position is timely adjusted when a problem occurs in a cutter, the cutter is replaced, the corresponding cutting speed is changed, a previous error process is effectively remedied, the probability that a product becomes a waste product is reduced, and the silicon wafer cutter correction process is simple in operation process.
Description
technical field [0001] The invention relates to the chip packaging industry, in particular to a silicon wafer cutter correction process. Background technique [0002] With the development of science and technology, the electronic industry has advanced by leaps and bounds, the demand for various integrated and control circuits has increased rapidly, and the demand for chip packaging has also increased rapidly. [0003] Chip packaging refers to installing the precise semiconductor integrated circuit chip on the frame, then using the lead to connect the chip to the frame pins, and finally sealing the semiconductor integrated circuit chip with epoxy resin, and the outside world through the pins and the internal Chip for signal transmission. Packaging is mainly to seal the precise semiconductor integrated circuit chip, so that the semiconductor integrated circuit chip will not be affected by external humidity and dust while it is functioning, and at the same time provide good an...
Claims
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IPC IPC(8): H01L21/67H01L21/304
CPCH01L21/67121H01L21/3043H01L21/67011
Inventor 葛建秋张彦陈玲
Owner 江阴苏阳电子股份有限公司