Silicon wafer cutter correction process

Abstract

The invention relates to a silicon wafer cutter correction process. The silicon wafer cutter correction process comprises the following steps of 1, correcting a cutting position that in the cutting process, a START / STOP key is pressed, a machine stops cutting, a working plate is moved under a microscope, a correction interface appears, and a reference line and a cutting area are adjusted to coincide with each other by using a Y inverted V key or a Y inverted V key; a F5 key is pressed, and the machine corrects the deviation between the cutting mark and the position of the cutting area; and theSTART / STOP key is pressed to enable the machine to start cutting again, then the START / STOP key is pressed to check whether correction is accurate or not, the process is repeated if correction is required to be continued, and the START / STOP key is pressed to enable the machine to start cutting again; 2, cutter replacement; and 3, correcting the cutting speed. According to the silicon wafer cuttercorrection process, when the cutter breaks down, the position of the cutter is adjusted in time, the cutter is replaced and the corresponding cutting speed is changed, the previous wrong process is effectively remedied, the possibility that a product becomes a waste product is reduced, and the operation process is simple.

Description

technical field [0001] The invention relates to the chip packaging industry, in particular to a silicon wafer cutter correction process. Background technique [0002] With the development of science and technology, the electronic industry has advanced by leaps and bounds, the demand for various integrated and control circuits has increased rapidly, and the demand for chip packaging has also increased rapidly. [0003] Chip packaging refers to installing the precise semiconductor integrated circuit chip on the frame, then using the lead to connect the chip to the frame pins, and finally sealing the semiconductor integrated circuit chip with epoxy resin, and the outside world through the pins and the internal Chip for signal transmission. Packaging is mainly to seal the precise semiconductor integrated circuit chip, so that the semiconductor integrated circuit chip will not be affected by external humidity and dust while it is functioning, and at the same time provide good an...

AI Technical Summary

Problems solved by technology

[0004] During the cutting process, the tool sometimes has a cutting error due to the negligence of the staff and needs to be corrected. There is no such correction process in the existing process