Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Processing technology of thermistor-buried semiconductor circuit board

A heat-sensitive semiconductor and thermistor technology, which is applied in the manufacturing of printed circuits, printed circuits, and multi-layer circuits, can solve the problems of high cost, low efficiency, and difficult production, and achieve the effect of solving the problem of low efficiency.

Inactive Publication Date: 2018-04-17
JIANGSU SUHANG ELECTRONIC CO LTD
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

So now it has been widely used in various electrical appliances, especially the successive explosions of Samsung mobile phones and Iphon mobile phones some time ago have triggered the explosive growth of this product. How to better use thermistors to protect various electrical appliances The primary consideration of electrical designers, but the current processing technology of buried thermistor semiconductor circuit boards, due to the difference in the thickness of the circuit board and thermistor, and the impedance of the circuit board itself, there are defects such as difficult production, low efficiency, and high cost.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Processing technology of thermistor-buried semiconductor circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] In conjunction with the accompanying drawings, the present invention is described in detail, but the scope of protection of the present invention is not limited to the following examples, that is, all simple equivalent changes and modifications made with the patent scope of the present invention and the content of the specification are still patents of the present invention. covered.

[0021] refer to figure 1 , a processing technology for embedding a thermistor semiconductor circuit board, comprising the following steps:

[0022] Step 1, prepare a heat-sensitive semiconductor 1, a double-sided copper core board 2, a copper-free optical core board 3 and a first prepreg 4, the double-sided copper core board is preset with one side of the heat-sensitive semiconductor as the inner layer, and its opposite side One side is the outer layer, and the circuit pattern is made on the inner layer copper of the double-sided copper core board, and the position corresponding to the h...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a processing technology of a thermistor-buried semiconductor circuit board. A thermistor semiconductor is welded on a core plate with a prepared pattern according to the neededposition, and next, an optical core plate milled with a groove position in advance, PP and a copper foil stacked structure are stacked to be subjected to lamination for the first time; a substrate which is laminated for the first time is subjected to laser HDI hole puncturing and electroless plating copper and electroplating for the first time; manufacturing of a second layer circuit and lamination of the second time are performed on the substrate after electroless plating copper and electroplating are completed; and next, manufacturing of the first layer and the four layer of circuits and the subsequent procedures are carried out. The circuit board obtained by the processing technology of the thermistor-buried semiconductor circuit board has the electrical performance of the circuit board as well as the functions of the high-reliability and high-stability thermistor, which has a good reputation from clients on the market; and particularly, the processing technology has very high modern smart phone market demand and quite high economic and social benefits.

Description

technical field [0001] The invention relates to a processing technology of a semiconductor circuit board for embedding a thermistor. Background technique [0002] Thermistor, that is, polymer positive temperature coefficient device (referred to as PTC device, PolymericPositive Temperature Coefficient abbreviation), this device can protect the circuit when the current surge is too large and the temperature is too high. When in use, it is connected in series in the circuit. Under normal circumstances, its resistance value is very small, and its loss is also very small, which does not affect the normal operation of the circuit; but if an overcurrent (such as a short circuit) occurs and its temperature rises, it will The resistance value of the circuit rises sharply to achieve the effect of limiting the current and avoid damaging the components in the circuit. When the fault is eliminated, the temperature of the PPTC device drops automatically and returns to a low-resistance st...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/46
CPCH05K3/4602H05K2201/10022
Inventor 倪蕴之朱永乐黄坤
Owner JIANGSU SUHANG ELECTRONIC CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products