A kind of preparation method of epoxy resin composition prepared by using mixer

An epoxy resin and composition technology, which is applied in the field of epoxy resin composition preparation, can solve the problems of short mold cleaning cycle, air holes in the package body, and poor mold release properties, so as to improve the yield of finished products and reduce the incidence of air holes. , the effect of stable performance

Active Publication Date: 2021-05-28
江苏中科科化新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The second object of the present invention is to solve the problems of poor mold release, short mold cleaning cycle, and air holes inside the packaging body of epoxy resin composition products currently used for semiconductor packaging by improving the processing technology, thereby providing a method for preparing semiconductors. Method of encapsulation with epoxy resin composition

Method used

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  • A kind of preparation method of epoxy resin composition prepared by using mixer
  • A kind of preparation method of epoxy resin composition prepared by using mixer
  • A kind of preparation method of epoxy resin composition prepared by using mixer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Weigh the above-mentioned various raw materials according to the content ratio in Table 1, and put the weighed A1, B1, C2 and C3, D, E, F, G, H1 and H2, I raw materials into the reactor, Hot-melt mixing was carried out at a temperature of 100° C., the temperature was lowered to room temperature after stirring evenly, and the hot-melted and lowered-to-room temperature mixture was pulverized to obtain an epoxy resin composition for semiconductor encapsulation. The obtained epoxy resin composition for semiconductor encapsulation was further molded, and the results of performance evaluation after encapsulating TO-220 with the molded epoxy resin composition are shown in Table 1.

Embodiment 2

[0046] Weigh the above-mentioned various raw materials according to the content ratio in Table 1, and put the weighed A2, B2, C3, D, E, F, G, H1 and H2, I raw materials into the reactor, at temperature When the temperature is 100°C, hot-melt mixing is carried out, the temperature is lowered to room temperature after stirring evenly, and the mixture which has been melted and cooled to room temperature is pulverized to obtain an epoxy resin composition for semiconductor encapsulation. The obtained epoxy resin composition for semiconductor encapsulation was further molded, and the performance evaluation results after TO-220 was packaged with the molded epoxy resin composition are shown in Table 1.

Embodiment 3

[0048]Weigh the above-mentioned various raw materials according to the content ratio in Table 1, and put the weighed A3, B1, C1 and C3, D, E, F, G, H1 and H2, I raw materials into the reactor, Hot-melt mixing was carried out at a temperature of 100° C., the temperature was lowered to room temperature after stirring evenly, and the hot-melted and lowered-to-room temperature mixture was pulverized to obtain an epoxy resin composition for semiconductor encapsulation. The obtained epoxy resin composition for semiconductor encapsulation was further molded, and the results of performance evaluation after encapsulating TO-220 with the molded epoxy resin composition are shown in Table 1.

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Abstract

The invention relates to a method for preparing an epoxy resin composition prepared by using a mixer. The present invention puts epoxy resin, curing agent phenolic resin, curing accelerator, coloring agent, mold release agent, inorganic filler, silane coupling agent, flame retardant and low stress modifier into the reactor, at temperature When the temperature is 100°C, heat-melt mixing is carried out, the temperature is lowered to room temperature after stirring evenly, and the mixture which has been heat-melted and cooled to room temperature is pulverized to obtain an epoxy resin composition for semiconductor encapsulation. Using the epoxy resin composition for semiconductor packaging of the present invention to package semiconductor devices and integrated circuits can increase the yield in the packaging process, have good mold release performance, greatly increase the number of packaging molds, and reduce the incidence of air holes inside the packaging body.

Description

technical field [0001] The invention relates to a preparation method of an epoxy resin composition for semiconductor encapsulation, in particular to a preparation method of an epoxy resin composition for semiconductor encapsulation which can improve the encapsulation moldability of the epoxy resin composition. Background technique [0002] In recent years, with the rapid development of the semiconductor industry, higher requirements have been put forward for the epoxy resin composition used in semiconductor packaging: improving the moldability of the packaging process, good mold release, longer mold cleaning cycle, and cleaner inside the package. High fillability; in the traditional processing method, due to too many components, the uniformity of mixing cannot be guaranteed in the process of high-speed mixer and twin-screw extrusion, and the final product is also prone to poor mold release, short mold cleaning cycle, and package body There are problems such as pores inside, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/08C08L61/06C08L91/06C08L83/04C08K13/02C08K3/36C08K3/04C08K3/22
CPCC08L63/00C08L63/08C08L2203/206C08L2205/025C08L2205/035C08L61/06C08L91/06C08L83/04C08K13/02C08K3/36C08K3/04C08K3/2279
Inventor 李海亮李刚王善学卢绪奎
Owner 江苏中科科化新材料股份有限公司
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