Preparation method of epoxy resin composition prepared by using agitator

A technology of epoxy resin and composition, which is applied in the field of preparation of epoxy resin composition, can solve the problems of poor mold release, air holes in the package body, and short mold cleaning cycle, and achieve stable performance, excellent packaging formability, and improved Yield Effect

Active Publication Date: 2018-04-24
江苏中科科化新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The second object of the present invention is to solve the problems of poor mold release, short mold cleaning cycle, and air holes inside the packaging body of epoxy resin composition products currently used for semiconductor packaging by improving the processing technology, thereby providing a method for preparing semiconductors. Method of encapsulation with epoxy resin composition

Method used

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  • Preparation method of epoxy resin composition prepared by using agitator
  • Preparation method of epoxy resin composition prepared by using agitator
  • Preparation method of epoxy resin composition prepared by using agitator

Examples

Experimental program
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Effect test

Embodiment 1

[0044] Weigh the above-mentioned various raw materials according to the content ratio in Table 1, and put the weighed A1, B1, C2 and C3, D, E, F, G, H1 and H2, I raw materials into the reactor, Hot-melt mixing was carried out at a temperature of 100° C., the temperature was lowered to room temperature after stirring evenly, and the hot-melted and lowered-to-room temperature mixture was pulverized to obtain an epoxy resin composition for semiconductor encapsulation. The obtained epoxy resin composition for semiconductor encapsulation was further molded, and the results of performance evaluation after encapsulating TO-220 with the molded epoxy resin composition are shown in Table 1.

Embodiment 2

[0046] Weigh the above-mentioned various raw materials according to the content ratio in Table 1, and put the weighed A2, B2, C3, D, E, F, G, H1 and H2, I raw materials into the reactor, at temperature When the temperature is 100°C, perform hot-melt mixing, stir evenly, cool down to room temperature, and pulverize the hot-melt and cool-down mixture to obtain an epoxy resin composition for semiconductor encapsulation. The obtained epoxy resin composition for semiconductor encapsulation was further molded, and the results of performance evaluation after encapsulating TO-220 with the molded epoxy resin composition are shown in Table 1.

Embodiment 3

[0048]Weigh the above-mentioned various raw materials according to the content ratio in Table 1, and put the weighed A3, B1, C1 and C3, D, E, F, G, H1 and H2, I raw materials into the reactor, Hot-melt mixing was carried out at a temperature of 100° C., the temperature was lowered to room temperature after stirring evenly, and the hot-melted and lowered-to-room temperature mixture was pulverized to obtain an epoxy resin composition for semiconductor encapsulation. The obtained epoxy resin composition for semiconductor encapsulation was further molded, and the results of performance evaluation after encapsulating TO-220 with the molded epoxy resin composition are shown in Table 1.

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Abstract

The invention relates to a preparation method of an epoxy resin composition prepared by using an agitator. The preparation method includes the steps of placing an epoxy resin, a curing agent phenolicresin, a curing accelerator, a coloring agent, a releasing agent, an inorganic filler, a silane coupling agent, a flame retardant and a low-stress modifier into a reaction vessel, performing hot-melting at a temperature of 100 DEG C, stirring uniformly, then cooling to room temperature, and smashing the hot-melted and cooled mixture to obtain the epoxy resin composition for semiconductor packaging. When the epoxy resin composition for semiconductor packaging is used in semiconductor device and integrated circuit packaging, the yield in the packaging process can be improved, the mold release performance is good, the package molding times are greatly increased, and the occurrence rate of air holes in package bodies is reduced.

Description

technical field [0001] The invention relates to a preparation method of an epoxy resin composition for semiconductor encapsulation, in particular to a preparation method of an epoxy resin composition for semiconductor encapsulation which can improve the encapsulation moldability of the epoxy resin composition. Background technique [0002] In recent years, with the rapid development of the semiconductor industry, higher requirements have been put forward for the epoxy resin composition used in semiconductor packaging: improving the moldability of the packaging process, good mold release, longer mold cleaning cycle, and cleaner inside the package. High fillability; in the traditional processing method, due to too many components, the uniformity of mixing cannot be guaranteed in the process of high-speed mixer and twin-screw extrusion, and the final product is also prone to poor mold release, short mold cleaning cycle, and package body There are problems such as pores inside, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/08C08L61/06C08L91/06C08L83/04C08K13/02C08K3/36C08K3/04C08K3/22
CPCC08L63/00C08L63/08C08L2203/206C08L2205/025C08L2205/035C08L61/06C08L91/06C08L83/04C08K13/02C08K3/36C08K3/04C08K3/2279
Inventor 李海亮李刚王善学卢绪奎
Owner 江苏中科科化新材料股份有限公司
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