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Epoxy resin composition for semiconductor packaging, and preparation method thereof

A technology of epoxy resin and novolac epoxy resin, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as poor mold release, air holes in the package, and short mold cleaning cycle, achieving stable performance, Excellent packaging moldability, the effect of improving yield

Inactive Publication Date: 2016-07-20
BEIJING SHOUKEHUA MICRO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The second object of the present invention is to solve the problems of poor mold release, short mold cleaning cycle, and air holes inside the packaging body of epoxy resin composition products currently used for semiconductor packaging by improving the processing technology, thereby providing a preparation purpose A method for epoxy resin composition for semiconductor encapsulation

Method used

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  • Epoxy resin composition for semiconductor packaging, and preparation method thereof
  • Epoxy resin composition for semiconductor packaging, and preparation method thereof
  • Epoxy resin composition for semiconductor packaging, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Weigh the above-mentioned various raw materials according to the content ratio in Table 1, and put the weighed B1, C2 and C3, E, H1 and H2, I raw materials into the reaction kettle, and carry out the process at a temperature of 120-180°C. Hot-melt and mix, stir evenly, cool down to room temperature, pulverize and ball-mill the mixture after hot-melt and cool down to room temperature, and pass through a 70-mesh sieve; mix the obtained powder with the weighed A1, D, F and G raw materials Stir uniformly in a high-speed mixer; melt, knead and extrude the uniformly stirred mixture in a twin-screw extruder, cool and pulverize to obtain an epoxy resin composition for semiconductor encapsulation. The obtained epoxy resin composition for semiconductor encapsulation was further molded, and the results of performance evaluation after encapsulating TO-22O with the molded epoxy resin composition are shown in Table 1.

Embodiment 2

[0045] Weigh the above-mentioned various raw materials according to the content ratio in Table 1, and put the weighed B2, C3, E, H1 and H2, I raw materials into the reaction kettle, and heat them at a temperature of 120-180°C Mix, stir evenly, cool down to room temperature, pulverize and ball mill the mixture that has been melted and cooled down to room temperature, and pass through a 70-mesh sieve; mix the obtained powder with weighed A2, D, F and G raw materials at high speed stirring uniformly in a mixer; melting, kneading and extruding the uniformly stirred mixture in a twin-screw extruder, cooling and pulverizing to obtain an epoxy resin composition for semiconductor encapsulation. The obtained epoxy resin composition for semiconductor encapsulation was further molded, and the results of performance evaluation after encapsulating TO-220 with the molded epoxy resin composition are shown in Table 1.

Embodiment 3

[0047] Weigh the above-mentioned various raw materials according to the content ratio in Table 1, and put the weighed B1, C1 and C3, E, H1 and H2, I raw materials into the reaction kettle, and carry out the process at a temperature of 120-180°C. Melt and mix, stir evenly, cool down to room temperature, pulverize and ball mill the mixture that has been melted and cooled to room temperature, and pass through a 70-mesh sieve; mix the obtained powder with the weighed A3, D, F and G raw materials Stir uniformly in a high-speed mixer; melt, knead and extrude the uniformly stirred mixture in a twin-screw extruder, cool and pulverize to obtain an epoxy resin composition for semiconductor encapsulation. The obtained epoxy resin composition for semiconductor encapsulation was further molded, and the results of performance evaluation after encapsulating TO-220 with the molded epoxy resin composition are shown in Table 1.

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Abstract

The invention relates to an epoxy resin composition for semiconductor packaging, and a preparation method thereof. The preparation method comprises the following steps: adding a curing agent phenolic resin, a curing accelerator, a mold lubricant, a fire retardant and a low stress modifier to a reaction kettle, carrying out hot melting mixing at 120-180DEG C, stirring until uniformity, cooling the obtained mixture to room temperature, crushing the cooled mixture, carrying out ball milling, and sieving the ball-milled mixture by a sieve; uniformly stirring the above obtained powder, epoxy resin, an inorganic filler, a coloring agent and a silane coupling agent in a high speed stirrer; and mixing and extruding the above obtained mixture in a double screw extruder, cooing the extruded mixture, and crushing the cooled mixture to obtain the epoxy resin composition for semiconductor packaging. The epoxy resin composition for semiconductor packaging has the advantages of increase of the yield in the packaging process, good mold release performance, great increase of the packaging frequency, and reduction of the incidence rate of pores in packaged bodies in packaging of semiconductor devices and integrated circuits.

Description

technical field [0001] The invention relates to an epoxy resin composition for semiconductor encapsulation, in particular to an epoxy resin composition for semiconductor encapsulation capable of improving the encapsulation moldability of the epoxy resin composition and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of the semiconductor industry, higher requirements have been put forward for the epoxy resin composition used in semiconductor packaging: improving the moldability of the packaging process, good mold release, longer mold cleaning cycle, and cleaner inside the package. High fillability; in the traditional processing method, due to too many components, the uniformity of mixing cannot be guaranteed in the process of high-speed mixer and twin-screw extrusion, and the final product is also prone to poor mold release, short mold cleaning cycle, and package body There are problems such as pores inside, and it is on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K13/06C08K9/06C08K7/18C08K3/22C08K3/04C08K3/34C08K3/28C08G59/62H01L21/56
Inventor 李海亮李刚王善学卢绪奎余金光
Owner BEIJING SHOUKEHUA MICRO ELECTRONICS
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