Silicone adhesive composition and adhesive tape

A technology of silicone adhesives and compositions, applied in the direction of film/sheet adhesives, non-polymer adhesive additives, adhesives, etc. To solve problems such as poor capacitance and insufficient curing, achieve the effects of favorable process and price, excellent adhesion, and excellent antistatic performance

Active Publication Date: 2018-04-24
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0024] The alkylene oxide solvent described in Patent Document 10 has poor compatibility with silicone adhesives, so there is a problem

Method used

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  • Silicone adhesive composition and adhesive tape
  • Silicone adhesive composition and adhesive tape
  • Silicone adhesive composition and adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment I

[0401] [Embodiment 1: the first scheme]

[0402] Embodiment 1 is about the embodiments and comparative examples of the first scheme. Each component used in the following Examples and Comparative Examples is as follows. In the following, the viscosity is a value at 25° C. measured using a Brookfield rotational viscometer (BM type viscometer).

[0403] (A) Addition curing silicone

[0404] ・Polysiloxane (a1): Both ends of the molecular chain are covered with dimethylvinylsilyl (SiMe 2 Vi group) end-capped vinyl-containing polydimethylsiloxane has a viscosity of 27000mPa·s in 30% toluene solution, and has a vinyl content of 0.075 mol%.

[0405] ・Polysiloxane (a2): Both ends of the molecular chain are covered with dimethylvinylsilyl (SiMe 2 Vi group) end-capped vinyl-containing polydimethylsiloxane has a viscosity of 27000mPa·s in 30% toluene solution, and has a vinyl content of 0.15 mol%.

[0406] ・Silicone (b): by Me 3 SiO 0.5 Cell and SiO 2 Units of polysiloxane (Me 3 ...

Embodiment 1

[0462] Use polyoxyalkylene compound (m=2, n=0) and ionic liquid A in embodiment 1 (I)~4 (I) and comparative example 1 (I) and 2 (I), changed polyoxyalkylene Amount of alkyl compound added. The results are shown in the following Table 1 (I) (the symbol (I) is omitted in the following table).

[0463]

[0464] Silicone Adhesive Composition I-α

Embodiment 5

[0465] Use polyoxyalkylene compound (m=8, n=0) and ionic liquid A in embodiment 5 (I)~8 (I) and comparative example 3 (I) and 4 (I), changed polyoxyalkylene Amount of alkyl compound added. The results are shown in the following Table 2 (I) (the symbol (I) is omitted in the following table).

[0466]

[0467] Silicone Adhesive Composition I-α

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Abstract

The present invention firstly addresses the problem of providing a silicone adhesive which provides a highly antistatic adhesive layer, exhibits excellent adhesion to a substrate, and reduces the amount of adhesive residue left on an adherend after an adhesive tape or adhesive film having the adhesive layer is peeled off from the adherend. The present invention secondly addresses the problem of providing a silicone adhesive composition which is satisfactorily cured by being heated for a short period of time, particularly, for less than 5 minutes and provides a highly antistatic adhesive layer.The present invention firstly provides an addition reaction-curing silicone adhesive composition, which is characterized by containing (A) an addition reaction-curing silicone, (B) a compound having,in each molecule, at least two unsaturated hydrocarbon groups and two (poly)oxyalkylene residues, and (C) a lithium-free ionic liquid. The present invention secondly provides an addition reaction-curing silicone adhesive composition, which is characterized by containing (A) an addition reaction-curing silicone, (B) a compound having, in each molecule, at least one unsaturated hydrocarbon group and at least one (poly)oxyalkylene residue, (C) a lithium-free ionic liquid, and (e) a non-complex platinum-group metal catalyst of a compound having unsaturated hydrocarbon bonds.

Description

technical field [0001] The present invention relates to silicone adhesive compositions and adhesive tapes. Specifically, it relates to a silicone adhesive composition having excellent antistatic properties and an adhesive tape using the same. Background technique [0002] In recent years, electronic instruments have become thinner, lighter and smaller. Along with this, electronic components mounted in electronic instruments have also become smaller. Silicone tapes are widely used as process tapes because of their high heat resistance, or as process transfer tapes because of their good re-peelability. [0003] However, since silicone adhesives have high electrical insulating properties, when thin and small electronic parts are peeled off, peeling electrification is caused, and in the worst case, dielectric breakdown of the electronic parts may be caused. Therefore, in order to prevent peeling electrification, it is necessary to develop an antistatic silicone adhesive. [...

Claims

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Application Information

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IPC IPC(8): C09J183/04C09J7/30C09J11/06C09J183/05C09J183/07C09J7/20
CPCC09J11/06C09J7/20C08G77/12C08G77/20C09J183/04C08L83/00C08L71/00C08K5/56
Inventor 黑田泰嘉
Owner SHIN ETSU CHEM IND CO LTD
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