Metal substrate circuit board welding tool and application method thereof

A metal substrate and welding tooling technology, which is applied in metal processing equipment, welding equipment, and the assembly of printed circuits with electrical components, can solve the problems of poor welding reliability, increased void probability, and easy generation of air bubbles. Improve welding quality and ensure the effect of flatness
CN107971602AActive Publication Date: 2018-05-01BEIJING BBEF SCI & TECH
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
BEIJING BBEF SCI & TECH
Publication Date
2018-05-01

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Abstract

A metal substrate circuit board welding tool comprises a backing board. The size of the backing board is consistent with that of a metal substrate. Fixed holes corresponding to threaded holes in the metal substrate are further formed in the backing board, and a spring screw is arranged on each fixed hole. The metal substrate circuit board welding tool further comprises a press plate, and springs are fixed to the bottom of the press plate. A hollowed portion is arranged at the middle position of the backing board, and stand columns used for locating the springs are put in the hollowed portion.
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Description

Technical field

[0001] The invention belongs to the technical field of circuit board manufacturing, and in particular relates to a metal substrate circuit board welding tool and a method of use thereof. Background technique

[0002] In the prior art welding process, the metal substrate and the printed board are welded, especially for the metal substrate with a large heat capacity. Generally, the welding efficiency of the preheating table is low and the quality is difficult to control. If reflow soldering is used, it can greatly improve production efficiency and improve the reliability of soldering. However, in the process of soldering a circuit board product produced by our company, there are the following problems:

[0003] 1. The thermal expansion coefficient of the metal substrate and the printed board are different, and the printed board will warp after welding.

[0004] 2. Printed circuit board soldered with metal substrate: The printed circuit board is composed of three printe...

Claims

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