Metal substrate circuit board welding tool and application method thereof

A metal substrate and welding tooling technology, which is applied in metal processing equipment, welding equipment, and the assembly of printed circuits with electrical components, can solve the problems of poor welding reliability, increased void probability, and easy generation of air bubbles. Improve welding quality and ensure the effect of flatness

Active Publication Date: 2018-05-01
BEIJING BBEF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] 3. If the flux is not completely volatilized during the welding process of the metal substrate and the printed board, it is easy to generate air bubbles, which increases the probability of voids and makes it difficult to meet the electrical performance indicators of the product.
[0006] 4. Since the solder sheet is heated and melted and thinned, the printed board and the metal substrate are not tightly bonded, resulting in poor welding reliability

Method used

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  • Metal substrate circuit board welding tool and application method thereof
  • Metal substrate circuit board welding tool and application method thereof
  • Metal substrate circuit board welding tool and application method thereof

Examples

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Embodiment 1

[0035] Such as Picture 10 Shown is a metal substrate circuit board welding tool, the metal substrate circuit board to be processed by this tool is such as figure 1 As shown, this type of circuit board product requires soldering three printed circuit boards 71, 72, and 73 on a metal substrate 8. The metal substrate 8 is provided with threaded holes for fixing the circuit board. A field effect tube should be installed between the circuit boards 71 ​​and 72, and a fixed screw hole is provided on the metal substrate for fixing the field effect tube. The metal base plate 8 plays a dual role. It is not only a base plate that is used as a product material for welding with the circuit board 7, but also a tooling base plate for fixed installation of the entire assembly of backing plates and pressing plates.

[0036] The welding tool includes a backing plate, and the backing plate is evenly distributed with vent holes. Such as figure 2 , 3 As shown, the backing board is divided into two ...

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Abstract

A metal substrate circuit board welding tool comprises a backing board. The size of the backing board is consistent with that of a metal substrate. Fixed holes corresponding to threaded holes in the metal substrate are further formed in the backing board, and a spring screw is arranged on each fixed hole. The metal substrate circuit board welding tool further comprises a press plate, and springs are fixed to the bottom of the press plate. A hollowed portion is arranged at the middle position of the backing board, and stand columns used for locating the springs are put in the hollowed portion.

Description

Technical field [0001] The invention belongs to the technical field of circuit board manufacturing, and in particular relates to a metal substrate circuit board welding tool and a method of use thereof. Background technique [0002] In the prior art welding process, the metal substrate and the printed board are welded, especially for the metal substrate with a large heat capacity. Generally, the welding efficiency of the preheating table is low and the quality is difficult to control. If reflow soldering is used, it can greatly improve production efficiency and improve the reliability of soldering. However, in the process of soldering a circuit board product produced by our company, there are the following problems: [0003] 1. The thermal expansion coefficient of the metal substrate and the printed board are different, and the printed board will warp after welding. [0004] 2. Printed circuit board soldered with metal substrate: The printed circuit board is composed of three printe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/08B23K1/00B23K1/20H05K3/34
CPCH05K3/34B23K1/00B23K1/20B23K3/08B23K3/087
Inventor 张诚肖薇孙列鹏吕红
Owner BEIJING BBEF SCI & TECH
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