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A kind of main chain benzoxazine composite resin with high frequency and low dielectricity, preparation method and application thereof

A benzoxazine and composite resin technology, which is applied in the field of organic polymer materials, can solve the problems of further improvement of dielectric properties, low cross-linking density, poor mechanical properties, etc., and achieves low dielectric loss and improved cross-linking density. and the effect of high temperature resistance and low dielectric constant

Active Publication Date: 2021-04-13
淮北绿洲新材料有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, benzoxazine resin also has its own defects, such as low crosslinking density, poor mechanical properties, high brittleness, especially the dielectric properties need to be further improved

Method used

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  • A kind of main chain benzoxazine composite resin with high frequency and low dielectricity, preparation method and application thereof
  • A kind of main chain benzoxazine composite resin with high frequency and low dielectricity, preparation method and application thereof
  • A kind of main chain benzoxazine composite resin with high frequency and low dielectricity, preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Take 40 parts of styrene-maleic anhydride and 60 parts of ODA main chain benzoxazine, adjust the solid content of the resin composition to 70 wt% with toluene solvent, stir at 85°C for 6 hours, and mix well. Then the obtained prepolymer is cured at 100-220° C. for 4-24 hours to obtain a binary composite resin. Its glass transition temperature is 307°C, its tensile strength is 108 MPa, its dielectric constant at 10 GHz is 2.9, and its dielectric loss is 0.006.

Embodiment 2

[0047] Take 20 parts of styrene-butadiene-divinylbenzene copolymer and 80 parts of ODA main chain benzoxazine, adjust the solid content of the resin composition to 70wt% with methyl ethyl ketone solvent, stir at 85°C for 7 hours ,well mixed. Then the obtained prepolymer is cured at 100-220° C. for 4-24 hours to obtain a binary composite resin. Its glass transition temperature is 300°C, its tensile strength is 106 MPa, its dielectric constant at 10 GHz is 2.8, and its dielectric loss is 0.007.

Embodiment 3

[0049] Get 20 parts of dicyclopentadiene epoxy resin, 30 parts of styrene-maleic anhydride, 50 parts of ODA type main chain benzoxazine, regulate the solid content of resin composition with dioxane solvent to be 65wt%, at 80 Stir at ℃ for 5 hours and mix well. Then the obtained prepolymer is cured at 100-220° C. for 4-24 hours to obtain a ternary composite resin. Its glass transition temperature is 315°C, its tensile strength is 118 MPa, its dielectric constant at 10 GHz is 2.8, and its dielectric loss is 0.008.

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Abstract

The invention relates to a high-frequency low-dielectric main chain benzoxazine composite resin and a preparation method thereof. It is a main chain benzoxazine / hydrocarbon resin binary resin, or a main chain benzoxazine / epoxy resin / hydrocarbon resin ternary resin. The main chain benzoxazine / hydrocarbon resin binary resin is a main chain benzoxazine / carbon resin obtained by cross-linking polymerization of 50 to 90 parts by weight of the main chain benzoxazine and 10 to 50 parts by weight of the hydrocarbon resin. Obtained by curing hydrogen resin binary prepolymers; the main chain benzoxazine / epoxy resin / hydrocarbon resin ternary resin consists of 50 to 80 parts by weight of main chain benzoxazine, 10 to 20 parts by weight of epoxy resin It is obtained by curing the main chain benzoxazine / epoxy resin / hydrocarbon resin ternary copolymerization system obtained by cross-linking polymerization and 10-30 parts by weight of hydrocarbon resin. The composite resin has low dielectric constant, low dielectric loss, high heat resistance, high flame resistance and flexibility under high-frequency electromagnetic wave conditions.

Description

technical field [0001] The invention relates to the technical field of organic polymer materials, in particular to a main chain benzoxazine composite resin, a preparation method and applications thereof. Background technique [0002] With the rapid development of electronic technology, the information processing of electronic products such as mobile communications, servers, and mainframe computers is constantly developing in the direction of "high-frequency signal transmission and high-speed digitization". The main development direction of high-speed substrates is to meet the requirements of high-frequency and high-speed information processing. [0003] In order to reduce the dielectric constant and dielectric loss of copper clad laminates, researchers in this technical field have begun to use resin systems with low dielectric constant and low dielectric loss factor, such as: benzoxazine resin, polyphenylene ether, Polyimide resin, polytetrafluoroethylene, thermoplastic pol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/34C08L35/06C08L25/10C08L63/00C08L47/00C08L63/04C08K9/02C08K3/04C08K9/04C08J3/24
CPCC08J3/246C08J2361/34C08J2425/10C08J2435/06C08J2447/00C08J2463/00C08L61/34C08L2205/03C08L2205/035C08L2205/04C08L35/06C08L25/10C08L63/00C08L47/00C08L63/04C08K9/04C08K3/04C08K9/02
Inventor 曾鸣谢慧曾碧君徐泽寰
Owner 淮北绿洲新材料有限责任公司