A kind of main chain benzoxazine composite resin with high frequency and low dielectricity, preparation method and application thereof
A benzoxazine and composite resin technology, which is applied in the field of organic polymer materials, can solve the problems of further improvement of dielectric properties, low cross-linking density, poor mechanical properties, etc., and achieves low dielectric loss and improved cross-linking density. and the effect of high temperature resistance and low dielectric constant
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Embodiment 1
[0045] Take 40 parts of styrene-maleic anhydride and 60 parts of ODA main chain benzoxazine, adjust the solid content of the resin composition to 70 wt% with toluene solvent, stir at 85°C for 6 hours, and mix well. Then the obtained prepolymer is cured at 100-220° C. for 4-24 hours to obtain a binary composite resin. Its glass transition temperature is 307°C, its tensile strength is 108 MPa, its dielectric constant at 10 GHz is 2.9, and its dielectric loss is 0.006.
Embodiment 2
[0047] Take 20 parts of styrene-butadiene-divinylbenzene copolymer and 80 parts of ODA main chain benzoxazine, adjust the solid content of the resin composition to 70wt% with methyl ethyl ketone solvent, stir at 85°C for 7 hours ,well mixed. Then the obtained prepolymer is cured at 100-220° C. for 4-24 hours to obtain a binary composite resin. Its glass transition temperature is 300°C, its tensile strength is 106 MPa, its dielectric constant at 10 GHz is 2.8, and its dielectric loss is 0.007.
Embodiment 3
[0049] Get 20 parts of dicyclopentadiene epoxy resin, 30 parts of styrene-maleic anhydride, 50 parts of ODA type main chain benzoxazine, regulate the solid content of resin composition with dioxane solvent to be 65wt%, at 80 Stir at ℃ for 5 hours and mix well. Then the obtained prepolymer is cured at 100-220° C. for 4-24 hours to obtain a ternary composite resin. Its glass transition temperature is 315°C, its tensile strength is 118 MPa, its dielectric constant at 10 GHz is 2.8, and its dielectric loss is 0.008.
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