Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

led package structure

A technology of LED packaging and packaging structure, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., and can solve the problems of reducing the light extraction efficiency of packaging, the aging of packaging glue, and the reduction of light intensity, etc.

Active Publication Date: 2020-07-07
张家界祯弘照明有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the chip absorbs the backscattered light, this direct coating method will reduce the light extraction efficiency of the package
In addition, if the phosphor is directly coated on the chip, the high temperature generated by the chip will significantly reduce the quantum efficiency of the phosphor, which will seriously affect the lumen efficiency of the package.
[0006] 3. The safe junction temperature of the LED chip should be within 110°C. If the junction temperature is too high, it will lead to a series of problems such as reduced light intensity, spectral shift, increased color temperature, increased thermal stress, and accelerated aging of the chip, which will be greatly reduced. The service life of the LED is shortened, and at the same time, it can also cause accelerated aging of the encapsulation gel filled on the chip, affecting its light transmission efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • led package structure
  • led package structure
  • led package structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] See figure 1 , figure 1 A schematic diagram of the LED package structure provided for an embodiment of the present invention, including:

[0037] LED base plate 11;

[0038] The first silica gel layer 12 is arranged on the LED bottom plate 11;

[0039] The lens area 13 is arranged on the first silica gel layer 12;

[0040] The second silica gel layer 14 is disposed on the first silica gel layer 12 and the lens area 13 .

[0041] Specifically, the silica gel refractive index of the first silica gel layer 12 is smaller than that of the second silica gel layer 14 , and the silica gel refractive index of the lens region 13 is greater than the silica gel refractive index of the first silica gel layer 12 and the second silica gel layer 14 .

[0042] Specifically, the LED bottom plate 11 includes a heat dissipation substrate and LED chips disposed on the heat dissipation substrate.

[0043] Further, see figure 2 , figure 2 It is a schematic diagram of an LED package h...

Embodiment 2

[0055] Please refer to Figure 4 , Figure 4 The flow chart of the LED packaging method provided by another embodiment of the present invention, this embodiment is based on the above-mentioned embodiments, and the packaging method of the LED packaging structure of the present invention is described in detail as follows. Specifically, include the following steps:

[0056] S21, selecting LED chips;

[0057] S22, selecting a bracket and a heat dissipation substrate;

[0058] S23. Welding the LED chip to the heat dissipation substrate;

[0059] S24. Coating a first silica gel layer on the LED chip;

[0060] S25, configuring fluorescent powder glue;

[0061] S26, preparing the lens area;

[0062] S27. Coating an outer phosphor glue on the lens area; and forming a second silica gel layer on the outer phosphor glue by using a hemispherical mold; to complete the LED package.

[0063] Preferably, the LED chip is an ultraviolet LED chip.

[0064] Specifically, step S22 may inclu...

Embodiment 3

[0096] Further, please refer to Figure 6 , Figure 6 It is a schematic diagram of a high-transmittance LED package structure provided in another embodiment of the present invention. The LED package structure provided in this embodiment is prepared by the method provided in the above-mentioned embodiments. Specifically, the LED packaging structure includes: a heat dissipation substrate 31 , an LED chip 32 , a first silica gel layer 33 , a lens area 34 and a second silica gel layer 35 from bottom to top.

[0097] Specifically, the first silica gel layer 33 is silica gel without phosphor; wherein, the first silica gel layer 33 does not contain phosphor, which separates the phosphor from the LED chip, and solves the problem of reduced quantum efficiency of the phosphor caused by high temperature.

[0098] Specifically, the refractive index of the first silica gel layer 33 , the second silica gel layer 35 and the silica gel in the lens area 34 increases sequentially.

[0099] Wh...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to an LED packaging structure, which comprises an LED bottom plate (11), a first silica gel layer (12), a lens area (13) and a second silica gel layer (14), wherein the first silica gel layer (12) is arranged on the LED bottom plate (11); the lens area (13) is arranged on the first silica gel layer (12); and the second silica gel layer (14) is arranged on the first silica gellayer (12) and the lens area (13). According to the LED packaging structure provided by the invention, by adopting a technology for separating fluorescent powder from an LED chip, the problem that the quantum efficiency of the fluorescent powder is reduced due to high temperature is solved; and silica gel in contact with the LED chip is high temperature-resistant silica gel, so that the problem that the light transmittance is reduced due to ageing and yellowing of the silica gel is solved; and meanwhile, provided silica gel spheres are uniformly arranged in a rectangle or diamond manner, so that uniform distribution of light of a light source in a concentration area can be ensured.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, in particular to an LED packaging structure. Background technique [0002] A light-emitting diode (Light-Emitting Diode, LED) has the characteristics of long life, high luminous efficiency, good color rendering, safety and reliability, rich colors and easy maintenance. Under the background of increasingly serious environmental pollution, climate warming and increasingly tense energy sources, semiconductor lighting technology developed based on high-power LEDs has been recognized as one of the most promising high-tech fields in the 21st century. This is a great leap in the history of human lighting since gas lighting, incandescent lamps and fluorescent lamps, and has rapidly improved the lighting quality of human life. [0003] Due to the complex structure and process of high-power LED packaging, it directly affects the performance and life of the LED; at present, the existing LED packaging...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/56H01L33/58
CPCH01L33/48H01L33/507H01L33/56H01L33/58
Inventor 张亮
Owner 张家界祯弘照明有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com