An online stress analysis device for gluing process
A technology of stress analysis and photosensitive adhesive, which is applied in the field of optical gluing, can solve problems such as the complexity of gluing process, and achieve the effects of improving gluing quality, ensuring surface shape accuracy, and ensuring reliability and stability
Active Publication Date: 2019-10-15
FUDAN UNIV
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[0030] The technical solutions of the present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.
[0031] Such as figure 1 As shown, the online stress analysis device of the gluing process of the present invention includes a transient interferometer 1, an optical beam expander system 2, an optical platform 3, a gluing unit 4, a five-dimensional adjustment frame 5, a data processing unit 6, a liquid crystal display 7, a temperature control unit 8 , UV illumination unit 9 , stress analysis unit 10 and vacuum degassing unit 11 . The optical beam expander system 2 consists of two positive focal length lens groups, the purpose of which is to expand the beam and increase the stress measurement range.
[0032] The collimated light emitted by the transient interferometer 1 is expanded by the optical beam expander system 2 into a collimated beam, reflected by the surface of the glued part 012, and then returned to the transient i...
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The invention discloses a glueing process online stress analysis device. The device includes a transient interferometer, an optical beam expansion system, a glueing unit, a data processing unit, a temperature control unit, a UV lighting unit and a stress analysis unit; the gluing unit is subjected to vacuum degassing and is solidified by the UV lighting unit, and the temperature control unit performs detection; the optical axes of the transient interferometer, the optical beam expansion system and the glueing unit are overlapped; collimated light emitted from the transient interferometer is expanded by the optical beam expansion system; the expanded light is reflected by the glueing unit to the transient interferometer; the transient interferometer outputs an interference pattern; the dataprocessing unit processes the interference pattern to obtain an interference pattern video image; and the data of the data processing unit, the temperature control unit, and the UV lighting unit aresimultaneously inputted to the stress analysis unit, so that the relationship of the change of stress with solidifying time, solidifying temperature, and light source intensity during a glueing process can be obtained. With the glueing process online stress analysis device of the invention adopted, adhesives suitable for different application conditions can be quickly found out, and the glueing time can be shortened.
Description
technical field [0001] The invention relates to the technical field of optical gluing, in particular to an online stress analysis device in the gluing process. Background technique [0002] In addition to mechanical fastening, optical gluing is used in various optical integration applications to secure optical or optomechanical parts. The gluing of optical or optical mechanical parts is a process of connecting two or more individual parts together according to certain technical requirements. Optical gluing technology has been used in optical instruments for 200 years. In 1785, the secretion of a natural true leafy fir tree was used to make the earliest optical gluing agent. With the development of the optical industry, new requirements are put forward for optical adhesives and optical adhesive processes, and natural resin adhesives can no longer meet the requirements of optical instruments. Therefore, synthetic resin glue comes out one after another. The currently commonl...
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IPC IPC(8): G01L1/24G01N19/04
Inventor 徐敏王军华孔令豹
Owner FUDAN UNIV