Wafer calibration method and device
A wafer calibration and wafer technology, applied in the field of wafer calibration methods and devices, can solve problems such as the inability of wafer calibration to meet high-precision requirements, and achieve the effects of solving the inability to meet high-precision requirements, improving accuracy, and improving user experience.
Inactive Publication Date: 2018-05-25
深圳市东飞凌科技有限公司
View PDF4 Cites 8 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] The purpose of the present invention is to provide a wafer calibration method and device to solve the technical problem in the prior art that wafer calibration cannot meet high precision requirements
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
specific Embodiment approach
[0056] Further, see figure 2 , as a specific embodiment of the wafer alignment device provided by the present invention, the high-definition camera 12 includes a lens 120, which faces the fixed ring 13, and can capture clear images at the micron scale. Preferably, the shooting range of the lens 120 is adjustable, so that the overall shape and structure of the wafer 200 can be clearly photographed, and the surface structure and shape of the wafer 200 within the range of 200-300um (micrometer) can be clearly photographed, so , the lens 120 provides more accurate graphic parameters for the calibration of the wafer 200, thereby improving the precision of wafer calibration.
[0057] Further, as a specific embodiment of the wafer calibration device provided by the present invention, the wafer calibration device 10 also includes a display (not shown), which is used to display the image taken by the high-definition camera 12. Here, the display can be set at The above-mentioned opera...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a wafer calibration method and relates to the technical field of semiconductor packaging. The method comprises the following steps that each substrate with multiple wafers is fixed to a fixed loop; a high-definition camera arranged over the fixed loop shoots the wafers one by one; and each wafer image is compared with a standard waver image, and the position and angle of thefixed loop is adjusted according to comparison results. The invention also provides a wafer calibration device. According to the wafer calibration method and device, the fixed loops whose positions and angles can be adjusted are used and the cameras are arranged over the fixed loop respectively, so that the wafer calibration device can obtain a high-definition image of each wafer; according to the image comparison results, the positions and angles of the wafers are adjusted via the fixed loops; and thus, the wafer calibration precision is improved, the technical problem that wafer calibrationcannot reach high precision requirement is solved effectively, the stability of eutectic technology is ensured, and the eutectic precision is improved.
Description
technical field [0001] The invention belongs to the technical field of semiconductor packaging, and more specifically relates to a wafer calibration method and device. Background technique [0002] Semiconductor packaging refers to the process of processing the tested wafers according to the product model and functional requirements to obtain independent chips. The packaging process is generally as follows: firstly, the wafer is cut into small chips through a dicing process, and then the cut chips are glued to the corresponding small island of the substrate frame (lead frame), and then the ultra-fine metal (lead frame) is used to Gold, tin, copper, aluminum) wires or conductive resin, connect the bonding pads of the chip to the corresponding pins of the substrate to form the required circuit; then the independent chip is packaged and protected with a plastic case. [0003] At present, the process of connecting the bonding pads of the chip to the corresponding pins of the su...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H01L21/68
CPCH01L21/681
Inventor 李华春刘超
Owner 深圳市东飞凌科技有限公司