Room-temperature low-pressure bonding technology for nitrile butadiene rubber and metal
A nitrile rubber and bonding technology, applied in the direction of adhesives, adhesive types, conjugated diene adhesives, etc., can solve the problems of time-consuming and laborious processing, high rejection rate, high production cost, etc. Improve the pass rate, improve the effect of high bonding molding curing pressure, and reduce the processing cost
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[0009] In reality, the bonding process of the nitrile rubber adhesive used for bonding between metal and nitrile rubber stipulates that the pressure when curing at room temperature is 0.01 to 0.2 MPa, that is, 0.1 to 2 ㎏ / cm2. This room temperature bonding pressure is extremely difficult for the bonding and manufacturing of metal and nitrile rubber bonding assemblies, so reducing the molding pressure for curing at room temperature is of great significance. The inventor has often verified through long-term experiments and concluded the invention. The principles and features of the invention will be described below with examples.
[0010] A room-temperature low-pressure bonding process between nitrile rubber and metal, including the following steps:
[0011] 1 Surface treatment of metal parts and nitrile rubber sheets or profiles
[0012] 1.1 Surface treatment of metal parts:
[0013] The bonding parts of the metal parts are treated with sand blowing, and then the bonding parts of the m...
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