Manufacturing process of PCB circuit board

A PCB circuit board and manufacturing process technology, applied in the direction of printed circuits, printed circuits assembled with electrical components, printed circuits connected with non-printed electrical components, etc., can solve pollution and corrosive gases, low capacity, waste of PCB layout and Space, affecting mechanical and electrical performance and other issues, to achieve the effect of promoting high-density PCB, saving PCB board surface or space, and simple structure

Inactive Publication Date: 2018-06-01
HANGZHOU TIANFENG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] PCB products are developing towards high-level, high-density, and high-frequency signals, but a large number of passive devices on the surface of the current PCB circuit board occupy a large amount of surface area of ​​the PCB, and at the same time require a large number o

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A manufacturing process of a PCB circuit board, comprising the steps of,

[0019] Step 1: First make a space for pre-placing passive components on the inner layer of a PCB substrate;

[0020] Step 2: Embedding passive components into the vacancy, and blanking the substrate;

[0021] Step 3: Screen-print insulating and heat-conducting materials on the substrate to form an insulating layer, and put the substrate printed with the insulating layer into an oven for semi-curing. The temperature of the oven is 130°C, and the baking time is 10 minutes; then put The hot press is pressed for 15 minutes, and the temperature of the hot press is 145°C;

[0022] Step 4: Bond the circuit, screen-print the circuit primer on the insulating layer of step 2; print the composite conductive powder on the circuit primer, and put it in the oven for 5 minutes, and set the temperature to 140 ° C; then put it in a hot press Machine pressing for 15 minutes at a temperature of 145°C.

[0023] S...

Embodiment 2

[0027] A manufacturing process of a PCB circuit board, comprising the steps of,

[0028] Step 1: First make a space for pre-placing passive components on the inner layer of a PCB substrate;

[0029] Step 2: Embedding passive components into the vacancy, and blanking the substrate;

[0030] Step 3: Screen-print insulating and heat-conducting materials on the substrate to form an insulating layer, and put the substrate printed with the insulating layer into an oven for semi-curing. The temperature of the oven is 155°C, and the baking time is 6 minutes; then put The hot press is pressed for 15 minutes, and the temperature of the hot press is 145°C;

[0031] Step 4: Bond the circuit, screen-print the circuit primer on the insulating layer of step 2; print the composite conductive powder on the circuit primer, and put it in the oven for 5 minutes, and set the temperature to 140 ° C; then put it in a hot press Machine pressing for 15 minutes at a temperature of 145°C.

[0032] St...

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PUM

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Abstract

The invention discloses a manufacturing process of a PCB circuit board. The manufacturing process comprises the following steps of 1, manufacturing a vacancy for pre-placing a passive device in an inner layer of a PCB substrate; 2, enabling the passive device to be embedded in the vacancy, and performing substrate cutting; 3, performing silk-screen printing of an insulating heat conducting material on the substrate to form an insulating layer, putting the substrate printed with the insulating layer into a drying oven to be half-cured, wherein the temperature of the drying oven is 125-160 DEG Cand the baking time is 15min or less; then putting the substrate into a hot press to be laminated for 15min at the hot pressing temperature of 145 DEG C; 4, performing circuit bonding, and performingsilk-screen printing of circuit base glue on the insulating layer obtained in the step 2, printing composite conductive powder on the circuit base glue, putting into the drying oven for 5min at a temperature of 140 DEG C; and next, putting into the hot press to be laminated for 15min at a temperature of 145 DEG C; and 5, drilling a conductive through hole, and enabling the passive device to be connected with circuit on the surface of the PCB substrate. The PCB circuit board is simple in structure and high in reliability, and the stability of the circuit board can be improved effectively.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, and in particular relates to a process for producing a PCB circuit board. Background technique [0002] In the 21st century, human beings have entered a highly informationized society, and PCB is an indispensable and important pillar in the information industry. At the same time, electronic equipment requires high performance, high speed, light weight and shortness, and as a multidisciplinary industry, PCB is the most critical technology for high-end electronic equipment. In PCB products, whether rigid, flexible, rigid-flexible multilayer boards, or module substrates for IC packaging substrates, they have made great contributions to high-end electronic equipment. Therefore, the PCB industry occupies an important position in electronic interconnection technology . [0003] PCB products are developing towards high-level, high-density, and high-frequency signals, but a large numbe...

Claims

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Application Information

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IPC IPC(8): H05K3/32H05K1/18
CPCH05K3/32H05K1/185
Inventor 吴民
Owner HANGZHOU TIANFENG ELECTRONICS CO LTD
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