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Polyimide film manufacturing method and polyimide film

The technology of a polyimide film and a manufacturing method is applied in the manufacture of polyimide film, the manufacturing method of polyimide film and the field of polyimide film, and can solve the problems of accumulated heat of flexible printed circuit boards and the like , to achieve high thermal conductivity and improve the effect of accumulated heat

Pending Publication Date: 2018-06-05
MORTECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above problems, the present invention provides a method for manufacturing a polyimide film and a polyimide film, so as to improve the thermal conductivity of the polyimide film and solve the problem of heat accumulation on a flexible printed circuit board

Method used

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  • Polyimide film manufacturing method and polyimide film
  • Polyimide film manufacturing method and polyimide film
  • Polyimide film manufacturing method and polyimide film

Examples

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Effect test

Embodiment 1-1

[0038] 49.63 g of alumina was added to 800 g of dimethylacetamide (DMAc) (purity: 99.95 wt %), and then, the dimethylacetamide solution was uniformly mixed to form a suspension.

[0039] Next, 72.35 g of 4,4'-diaminodiphenyl ether (ODA) was added to the suspension, and mixed evenly to dissolve it.

[0040] Next, 78.02 g of pyromellitic dianhydride (PDMA) was added and stirred for 6 hours to perform a polymerization reaction to obtain a polyamic acid mixture. The temperature of the polymerization reaction is controlled at 20°C to 30°C. The subsequent drying, film formation, imidization, and uniaxial stretching are the same as in Comparative Example 1, and will not be repeated here.

Embodiment 1-2

[0042] The steps of Example 1-2 are similar to those of Example 1-1. The difference between Example 1-2 and Example 1-1 is that the fixing method is different in the polyimidization process. In Example 1-2, the polyimide film In a fixed state, the polyamic acid film was heated at 300° C. for 10 minutes to perform an imidization reaction to obtain a polyimide film.

Embodiment 2-1

[0044] 48.53 g of alumina and 4.41 g of boron nitride were added to 800 g of dimethylacetamide (DMAc) (purity: 99.95 wt %), and then the dimethylacetamide solution was uniformly mixed to form a suspension.

[0045] Next, 70.76 g of 4,4'-diaminodiphenyl ether (ODA) was added to the suspension, and mixed evenly to dissolve it.

[0046] Next, 76.3 g of pyromellitic dianhydride (PDMA) was added, and stirred for 6 hours to perform a polymerization reaction to obtain a polyamic acid mixture. The temperature of the polymerization reaction is controlled at 20°C to 30°C. The subsequent drying, film formation, imidization, and uniaxial stretching are the same as in Comparative Example 1, and will not be repeated here.

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Abstract

The invention discloses a polyimide film manufacturing method and a polyimide film. The polyimide film manufacturing method comprises forming a polyamide acid mixture comprising inorganic particles, adiamine monomer and a tetracarboxylic dianhydride monomer; heating the polyamide acid mixture at a drying temperature to form a polyamide acid film; subjecting the polyamic acid film to amidation reaction to form a polyimide film, wherein the organic particles is 10 wt% to 50 wt% with respect to the total weight of the inorganic particles, the diamine monomer and the tetracarboxylic dianhydride monomer, and the thermal conductivity of the polyimide film is 0.4 W / mK or more.

Description

technical field [0001] The invention relates to a method for manufacturing a polyimide film and the polyimide film, in particular to a method for manufacturing a polyimide film with good thermal conductivity and the polyimide film. Background technique [0002] Polyimide is a polymer material with excellent mechanical properties, heat resistance and chemical corrosion resistance. Therefore, polyimide has been widely used in flexible printed circuit boards, such as mobile phones, camera modules, touch panel modules, liquid crystal display panels and tablet computers. However, electronic components will generate heat when they are working. Excessive heat accumulation will cause the internal temperature of electronic products to be too high and cause damage to components. Therefore, the technology of improving the heat dissipation characteristics of electronic components has been paid attention to. [0003] Since polyimide film itself has good heat resistance but poor thermal ...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L79/08C08G73/10C08K3/22C08K3/38C08K3/28C08K3/24
CPCC08G73/1071C08J5/18C08J2379/08C08K3/22C08K3/24C08K3/28C08K3/38C08K2003/2227C08K2003/282C08K2003/385
Inventor 孙德峥许艳惠陈启盛李国维
Owner MORTECH CORP
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