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Stable electroplate liquid

A technology of electroplating solution and stability, which is applied in the field of stable electroplating solution, can solve the problems of weak plating ability, poor stability of electroplating solution, and slow plating speed, and achieve fast plating speed, strong throwing ability and reduced surface tension Effect

Inactive Publication Date: 2018-06-08
阿尔发埃德伟控汽车配件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to propose a stable electroplating solution in order to solve the technical problems of poor electroplating solution stability, weak throwing ability and slow electroplating speed in the prior art.

Method used

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  • Stable electroplate liquid

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Embodiment 1

[0015] A kind of stable electroplating solution of the present invention, described comprises copper sulfate pentahydrate, sulfuric acid, hydrochloric acid, accelerator and wetting agent, and described accelerator is the mixture of one or more mercaptan compounds, described The wetting agent is a mixture of one or more polyalcohol compounds; the concentration of copper sulfate pentahydrate in the stable electroplating solution is 70g / L, the concentration of sulfuric acid is 96mL / L, and the concentration of hydrochloric acid is 44mg / L L, the concentration of the accelerator is 0.5mL / L, and the concentration of the wetting agent is 13mL / L. A preferred composition of the accelerator includes methyl mercaptan, ethanethiol, ethanedithiol, 1-propanethiol and 1,3-propanedithiol; the content percentage of the accelerator composition is: Thiol 40%, Ethanethiol 30%, Ethanedithiol 10%, 1-Propanedithiol 10%, and 1,3-Propanedithiol 5%. A preferred composition of the wetting agent includes...

Embodiment 2

[0017] A kind of stable electroplating solution of the present invention, described comprises copper sulfate pentahydrate, sulfuric acid, hydrochloric acid, accelerator and wetting agent, and described accelerator is the mixture of one or more mercaptan compounds, described The wetting agent is a mixture of one or more polyalcohol compounds; the concentration of copper sulfate pentahydrate in the stable electroplating solution is 77g / L, the concentration of sulfuric acid is 100mL / L, and the concentration of hydrochloric acid is 50mg / L L, the concentration of the accelerator is 0.7mL / L, and the concentration of the wetting agent is 16mL / L. A preferred composition of the accelerator includes methyl mercaptan, ethanethiol, ethanedithiol, 1-propanethiol and 1,3-propanedithiol; the content percentage of the accelerator composition is: Mercaptan 45%, Ethanethiol 35%, Ethanedithiol 15%, 1-Propanedithiol 15%, and 1,3-Propanedithiol 8%. A preferred composition of the wetting agent inc...

Embodiment 3

[0019] A kind of stable electroplating solution of the present invention, described comprises copper sulfate pentahydrate, sulfuric acid, hydrochloric acid, accelerator and wetting agent, and described accelerator is the mixture of one or more mercaptan compounds, described The wetting agent is a mixture of one or more polyalcohol compounds; the concentration of copper sulfate pentahydrate in the stable electroplating solution is 85g / L, the concentration of sulfuric acid is 108mL / L, and the concentration of hydrochloric acid is 65mg / L L, the concentration of the accelerator is 0.9mL / L, and the concentration of the wetting agent is 20mL / L. A preferred composition of the accelerator includes methyl mercaptan, ethanethiol, ethanedithiol, 1-propanethiol and 1,3-propanedithiol; the content percentage of the accelerator composition is: Thiol 50%, Ethanethiol 0%, Ethanedithiol 20%, 1-Propanedithiol 20%, and 1,3-Propanedithiol 10%. A preferred composition of the wetting agent include...

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Abstract

The invention relates to the technical field of electroplate liquid, in particular to a stable electroplate liquid. The stable electroplate liquid comprises blue copperas, sulfuric acid, hydrochloricacid, an accelerator and a wetting agent; the accelerator is a mixture of one or more mercaptan compounds; the wetting agent is a mixture of one or more polyalcohol compounds; and the concentration ofthe blue copperas of the stable electroplate liquid is 70-85 g / L, the concentration of the sulfuric acid is 96-108mL / L, the concentration of the hydrochloric acid is 44-65mg / L, the concentration of the accelerator is 0.5-0.9mL / L, and the concentration of the wetting agent is 13-20mL / L. The stable electroplate liquid has the advantages of good stability, high uniform coverage ability and fast electroplating speed, and can be used in various industrial plating fields.

Description

technical field [0001] The invention relates to the technical field of electroplating solution, in particular to a stable electroplating solution. Background technique [0002] In the process of mechanical processing, the rust-proof grease, cutting fluid grease, mechanical grease, lubricating grease, grinding fluid, mold release agent, etc., which are usually adhered to the surface of the parts, are mixed with dust and grinding dust, forming a relatively thick dirt. If the above dirt is not removed in time before heat treatment, the dust and dust attached to the parts will be inconvenient to remove oil and rust after quenching and sintering into stubborn solid grease. pinhole. In addition, when the mesh belt type resistance furnace is used for quenching, the oil stains on the surface of the parts and dust and other impurity particles are mixed together and sintered into stubborn solid grease. It is difficult to completely remove the above dirt during electroplating. Hydro...

Claims

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Application Information

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IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 黄爱武董显益
Owner 阿尔发埃德伟控汽车配件有限公司
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