Method For Manufacturing Laminated Electronic Part

Abstract

The invention provides a method for manufacturing a laminated electronic part capable of increasing the ratio of the capacity forming part and preventing the conductive paste from protruding to the side surface in the pressing step. The method for manufacturing the laminated electronic part is characterized in that the method comprises the following steps: in the laminating step, a first green sheet in which an internal electrode pattern of a first shape is formed by the conductive paste, and a second green sheet in which the internal electrode pattern of the second shape is formed by the conductive paste are laminated to form a laminate; in the pressing step for pressing the laminate in the laminating direction, a graph which is drawn when the internal electrode pattern of the first shapeis overlapped with the internal electrode pattern of the second shape has an internal electrode pattern portion which is a region where no internal electrode pattern exists, and an insulating patternportion which is a region where no internal electrode pattern exists. The shape of the internal electrode pattern part is designed relative to the design shape in the pressing process in an expandingamount from the internal electrode pattern to the insulating pattern part in an insulating pattern part departing direction.

Description

technical field [0001] The present invention relates to a method of manufacturing laminated electronic components. Background technique [0002] In the manufacturing process of the laminated ceramic capacitor, a pressure-bonding process is performed in which a plurality of green sheets on which internal electrode layers are formed using a conductive paste are laminated to form a laminate, and the laminate is pressure-bonded. [0003] In the laminated body, a difference in lamination thickness occurs between a portion where the internal electrode layer is formed and a portion where the internal electrode layer is not formed. Therefore, in the crimping step, a greater pressure is applied to the portion where the internal electrode layer is formed, and the conductive paste spreads toward the portion where the internal electrode layer is not formed. Therefore, the shape of the internal electrode pattern is designed in consideration of the expansion of the conductive paste durin...

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Problems solved by technology

However, as described above, if the width of the insulating pattern portion is widened in order to prevent the conductive paste from extending to the side, the ratio of the capacitance forming portion cannot be avoided, so there is a problem that the above-mentioned demand for large capacitance cannot be met.

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