Radiator with temperature-controlled water supply unit
A heat dissipation device and water supply technology, which is applied in the direction of electrical components, semiconductor/solid-state device parts, semiconductor devices, etc., can solve the problems of accelerating air, increasing heat generation of radiators, and affecting heat dissipation performance, etc.
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[0044] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0045] Such as figure 1 As shown, the cooling device of the present invention is composed of a radiator 7, a device fixing platform 18, a temperature-controlled water supply unit and a breathing unit.
[0046] The water tank 9 in the temperature-controlled water supply unit is separated from the radiator 7 and installed at a position higher than the radiator 7 . The component fixing platform 18 is located on the upper part of the radiator 7, and the breathing unit is embedded in the radiator 7. Power devices that need to be dissipated are fixed on the device fixing platform 18 .
[0047] The water tank 9 in the temperature-controlled water supply unit is connected to the breathing unit through the water guide pipe 12 and the temperature-controlled regulating valve 10, and provides evaporation and cooling water to the breathing unit;
[0048]...
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