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Aligning station device

A station and clamping block technology, applied in the field of normalization station devices, can solve the problems of broken vacuum, products cannot be firmly sucked, and adsorbed to the edge of the carrier, etc.

Pending Publication Date: 2018-06-15
SUZHOU DELPHI LASER +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If there is an error in the position of the carrier, it is very likely that the subsequent suction cup assembly will be vertically downward and then adsorbed to the edge of the carrier, or even not adsorbed to the carrier, which will lead to a broken vacuum phenomenon, so that the product cannot be firmly sucked and lifted

Method used

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Embodiment Construction

[0031] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, specific implementations are now described in detail.

[0032] like figure 1 , figure 2 As shown, the normalizing station device includes a driving wheel 603, a driven wheel 604, a synchronous belt 606, a first clamping block 607, a second clamping block 608, a left sliding plate 610, a right sliding plate 609, a normalizing left retaining strip 612, a normalizing The right bar 611 and the base plate 605, the driving wheel 603 and the driven wheel 604 are all rotatably supported on the bearing seat, the bearing seat is installed on the base plate 605, the timing belt 606 is set on the driving wheel 603 and the driven wheel 604, and the timing belt One side of 606 installs the first clamping block 607, and the other side of synchronous belt 606 installs the second clamping block 608, and the first clamping block 607 and the second clamping block 608 are me...

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Abstract

The invention relates to an aligning station device. A driving wheel and a driven wheel are rotatably and freely supported on a base plate; a synchronous belt sleeves on the driving wheel and the driven wheel; a first clamping block is arranged on one side of the synchronous belt; a second clamping block is arranged on the other side of the synchronous belt; a right sliding plate and a left sliding plate are correspondingly arranged on the first clamping block and the second clamping block; an aligning left barrier strip and an aligning right barrier strip are correspondingly arranged on the left sliding plate and the right sliding plate, and are arranged in parallel; the synchronous belt drives the first clamping block and the second clamping block to linearly move in an opposite movementdirection, so that the left sliding plate and the right sliding plate linearly move in the opposite movement direction, the aligning left barrier strip and the aligning right barrier strip are drivento move face to face or oppositely at the same time, and a closing action or an opening action is produced for positioning and centering a carrier. The aligning station device is used for aligning the carrier transported from a taking mechanism, and automatically positioning and centering, so that a preparation is made for a following process, and the point-to-point transporting accuracy during transporting is improved.

Description

technical field [0001] The invention relates to a correcting station device for positioning and centering, and belongs to the technical field of automation equipment. Background technique [0002] The automatic loading and unloading system of wafer laser cutting equipment mainly uses three-degree-of-freedom wafer handling manipulators for wafer handling. The existing three-degree-of-freedom wafer handling manipulators are standard outsourcing parts, and the equipment layout will be affected by the manipulator handling space. The overall equipment The layout needs to be carried out according to the handling space of the manipulator, resulting in low equipment space utilization. At the same time, the manipulator itself is relatively expensive, which is not conducive to batch equipment cost control and mass production. In terms of handling accuracy, the structural characteristics of the three-degree-of-freedom wafer handling manipulator, the point-to-point handling accuracy is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/70B23K26/38B23K26/402B23K37/04B23K101/40
CPCB23K26/38B23K26/402B23K26/702B23K37/04
Inventor 赵裕兴李军
Owner SUZHOU DELPHI LASER
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