Cured epoxy resin and epoxy resin composition

Abstract

The invention provides cured epoxy resin and an epoxy resin composition. The cured epoxy resin is prepared from 45 to 55 parts of high-temperature mixture, 21 to 23 parts of aluminum oxide, 17 to 20 parts of isoprene, 15 to 20 parts of N-butanol glycidyl ether, 10 to 13 parts of carbon fibers, and 12 to 13 parts of diluting agent. The curing reaction rate of the cured epoxy resin is high, and thecuring effect can be improved. Moreover, the epoxy resin composition utilizing the cured epoxy resin has the advantages of good curing effect, high stability, excellent viscosity and the like.

Description

technical field [0001] The invention relates to the fields of cured epoxy resins and epoxy resin compositions. Background technique [0002] Epoxy resins have superior heat resistance, mechanical properties, electrical properties, and adhesion. Epoxy resins take advantage of this property and are used as sealing materials for wiring boards, circuit boards, and multilayered circuit boards, semiconductor chips, coils, circuits, and the like. Alternatively, epoxy resins can also be used as resins for adhesives, coatings, and fiber-reinforced resins. [0003] However, since epoxy resins are usually brittle, there is a problem that cracks are likely to occur due to stress and strain, heat, and mechanical impact during curing with a curing agent or during use. Contents of the invention [0004] The object of the present invention is to provide an epoxy resin cured product and an epoxy resin composition for solving the problems existing in the prior art. [0005] In order to a...

AI Technical Summary

Problems solved by technology

[0003] However, since epoxy resins are generally brittle, there is a problem that cracks are likely to occur due to stress and strain, heat, and mechanical impact when curing with a curing agent or during use.