The invention discloses a method for preparing a
halogen-free
flame-retardant high-Tg
copper-clad plate, and the method comprises the following steps: preparing a glue solution, to be more specific, preparing the glue solution comprising the components of 50-80 parts by weight of bismaleimide resin, 40-70 parts by weight of
phosphorus-containing
epoxy resin, 10-18 parts by weight of Polyetheretherketone resin, 10-16 parts by weight of low molecular weight
polyimide, 12-14 parts by weight of an active
diluent, 10-30 parts by weight of a DICY curing agent, 5-10 parts by weight of a curing agent
promoter, 50-72 parts by weight of an
inorganic filler and 60-80 parts by weight of a
solvent, and evenly mixing; applying the glue solution; overlapping and pressing. The pressed formed
copper-clad plate has conventional
copper-clad plate basic properties such as
electrical performance, insulation performance and the like, the
flame retardant performance can achieve V-0 level (UL94 standard), the Tg > 250 DEG C, at the same time the
halogen-free
flame-retardant high-Tg copper-clad plate also has special performance such as low
dielectric constant and
dielectric loss, and can meet the market demand.