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Method for preparing halogen-free flame-retardant high-Tg copper-clad plate

A manufacturing method and technology of copper clad laminates, applied in chemical instruments and methods, lamination, layered products, etc., can solve the problems of low heat resistance, unfavorable alignment, resin greasy, etc. The effect of market demand

Inactive Publication Date: 2016-12-21
重庆德凯实业股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the glass transition temperature of ordinary FR-4 boards is between 130-140 ° C, the thermal expansion coefficient in the Z-axis direction is large, the heat resistance is low, resin greasy stains are easily generated during drilling, large shrinkage during processing, and unfavorable alignment. have certain limitations

Method used

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  • Method for preparing halogen-free flame-retardant high-Tg copper-clad plate
  • Method for preparing halogen-free flame-retardant high-Tg copper-clad plate
  • Method for preparing halogen-free flame-retardant high-Tg copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Example 1 Preparation of halogen-free flame-retardant high Tg copper clad laminate

[0047] 1) Preparation of insulating layer glue formula (parts by weight):

[0048] Bismaleimide resin 50;

[0049] Phosphorus epoxy resin 40;

[0050] Polyetheretherketone resin 10;

[0051] Low molecular weight polyimide 10;

[0052] Active diluent 12;

[0053] DICY curing agent 10;

[0054] Curing agent accelerator 0.5;

[0055] Inorganic filler 50;

[0056] Solvent 160;

[0057] The components are mixed thoroughly for 8 hours, and the gel time is 255S.

[0058] 2) Gluing: Glue the glass fiber cloth and dry it in a vertical gluing machine to prepare a prepreg. The gluing speed is 20m / min. Control parameters: gelation time is 100S, resin content is 40%, fluidity 28%;

[0059] 3) Laminating and pressing: Control the pressing parameters according to product thickness requirements:

[0060] Vacuum degree: 0.05Mpa;

[0061] Pressure: 500PSI;

[0062] Heating rate: 2℃ / min;

[0063] Hot plate temperature: 120~23...

Embodiment 2

[0067] Example 2 Preparation of halogen-free flame-retardant high Tg copper clad laminate

[0068] 1) Preparation of insulating layer glue formula (parts by weight):

[0069] Bismaleimide resin 65;

[0070] Phosphorus epoxy resin 55;

[0071] Polyetheretherketone resin 15;

[0072] Low molecular weight polyimide 14;

[0073] Active diluent 13;

[0074] DICY curing agent 20;

[0075] Curing agent accelerator 0.8;

[0076] Inorganic filler 60;

[0077] Solvent 180;

[0078] The components are mixed thoroughly for 8 hours, and the gel time is 255S.

[0079] 2) Gluing: Glue the glass fiber cloth and dry it in a vertical gluing machine to prepare a prepreg. The gluing speed is 22m / min. Control parameters: gelation time is 120S, resin content is 43%, fluidity 25%;

[0080] 3) Laminating and pressing: Control the pressing parameters according to product thickness requirements:

[0081] Vacuum degree: 0.05Mpa;

[0082] Pressure: 550PSI;

[0083] Heating rate: 2℃ / min;

[0084] Hot plate temperature: 120~23...

Embodiment 3

[0088] Example 3 Preparation of halogen-free flame-retardant high Tg copper clad laminate

[0089] 1) Preparation of insulating layer glue formula (parts by weight):

[0090] Bismaleimide resin 80;

[0091] Phosphorus epoxy resin 70;

[0092] Polyetheretherketone resin 18;

[0093] Low molecular weight polyimide 16;

[0094] Active diluent 14;

[0095] DICY curing agent 30;

[0096] Curing agent accelerator 1;

[0097] Inorganic filler 72;

[0098] Solvent 80;

[0099] The components are mixed thoroughly for 8 hours, and the gel time is 255S.

[0100] 2) Gluing: Glue the glass fiber cloth and dry it in a vertical gluing machine to prepare a prepreg. The gluing speed is 22m / min. Control parameters: gelation time is 120S, resin content is 43%, fluidity 25%;

[0101] 3) Laminating and pressing: Control the pressing parameters according to product thickness requirements:

[0102] Vacuum degree: 0.05Mpa;

[0103] Pressure: 550PSI;

[0104] Heating rate: 2℃ / min;

[0105] Hot plate temperature: 120~230℃;...

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Abstract

The invention discloses a method for preparing a halogen-free flame-retardant high-Tg copper-clad plate, and the method comprises the following steps: preparing a glue solution, to be more specific, preparing the glue solution comprising the components of 50-80 parts by weight of bismaleimide resin, 40-70 parts by weight of phosphorus-containing epoxy resin, 10-18 parts by weight of Polyetheretherketone resin, 10-16 parts by weight of low molecular weight polyimide, 12-14 parts by weight of an active diluent, 10-30 parts by weight of a DICY curing agent, 5-10 parts by weight of a curing agent promoter, 50-72 parts by weight of an inorganic filler and 60-80 parts by weight of a solvent, and evenly mixing; applying the glue solution; overlapping and pressing. The pressed formed copper-clad plate has conventional copper-clad plate basic properties such as electrical performance, insulation performance and the like, the flame retardant performance can achieve V-0 level (UL94 standard), the Tg > 250 DEG C, at the same time the halogen-free flame-retardant high-Tg copper-clad plate also has special performance such as low dielectric constant and dielectric loss, and can meet the market demand.

Description

Technical field [0001] The invention is a method for manufacturing a halogen-free flame-retardant high Tg copper clad laminate, which belongs to the technical field of copper clad laminates. Background technique [0002] Following the successive implementation of the European Union and Mainland China’s ROHS, substances containing lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers are no longer allowed to be used in the manufacture of electronic products or their components; Greenpeace ( GreenPeace) The greening policy vigorously promoted at this stage requires all manufacturers to completely eliminate brominated flame retardants and polyvinyl chloride in their electronic products to comply with both lead-free and halogen-free green electronics. However, there are still many circuit board industries that use bromine-containing compounds because brominated flame retardants have excellent flame retardant effects and low cost; whe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/12B32B37/10C08L79/04C08L63/00C08L61/16C08L79/08C08K3/22C08K3/36
CPCB32B37/12B32B37/10B32B2262/101B32B2307/206B32B2307/3065C08K2201/003C08L79/04C08L2205/035C08L63/00C08L61/16C08L79/08C08K3/22C08K3/36
Inventor 李洪彬
Owner 重庆德凯实业股份有限公司
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