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Antistatic packaging material

A packaging material and anti-static technology, applied in polyurea/polyurethane coatings, devices for coating liquid on the surface, and other chemical processes, can solve the problems of complicated production and high cost, and achieve simple preparation process, low cost, and easy The effect obtained

Inactive Publication Date: 2008-03-05
黄晖
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the multi-layer packaging material can prevent and remove static electricity well, the packaging material is complicated to make and the cost is very high

Method used

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  • Antistatic packaging material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A conductive polymer packaging material, comprising a substrate and at least one conductive polymer layer coated on the substrate, characterized in that the conductive polymer layer is composed of the following materials in weight percentage:

[0026] Carbon powder 5%, polyurethane 40%, dispersant 5%, coupling agent 4%, thinner 20%, thickener 1%, solvent 25%;

[0027]The base material of the present invention selects PS polystyrene, the dispersant selects PVP polyvinyl pyrrolidone, the described coupling agent selects heptyl trimethoxysilane, and the described diluent selects epoxy resin diluent , The thickener is an associative polyurethane thickener, and the solvent is deionized water.

[0028] First, after debugging the conductive polymer formula, heat the substrate to the required temperature below the melting point, and then apply the mixed conductive polymer on the surface of the substrate through the coating equipment, as shown in Figure 1, on the substrate 2 On...

Embodiment 2

[0030] A conductive polymer packaging material, comprising a substrate and at least one conductive polymer layer coated on the substrate, characterized in that the conductive polymer layer is composed of the following materials in weight percentage:

[0031] Carbon powder 0.5%, polyurethane 60%, dispersant 2%, coupling agent 0.5%, thinner 18%, thickener 2.5%, solvent 16.5%.

[0032] Wherein the substrate is selected from PE polyethylene, the dispersant is selected from RSH alkyl mercaptan, the coupling agent is selected from dodecyl trimethoxysilane, and the diluent is selected from epoxy resin diluent. The agent is polycarboxylic acid thickener, and the solvent is distilled water.

Embodiment 3

[0034] A conductive polymer packaging material, comprising a substrate and at least one conductive polymer layer coated on the substrate, characterized in that the formula of the conductive polymer layer is as follows:

[0035] Carbon powder 2%, polyurethane 55%, dispersant 3%, coupling agent 2%, thinner 18%, thickener 0.6%, solvent 17.4%, anti-blocking agent 2%.

[0036] Wherein the base material is selected PET polyethylene terephthalate, the dispersant is selected PVP polyvinylpyrrolidone, the described coupling agent is selected long-chain alkyl trimethoxysilane, and the described diluent is selected epoxy resin to dilute The thickener is a cross-linked polymer emulsion formed by copolymerization of ethyl acrylate and methacrylic acid, the anti-blocking agent is talc, and the solvent is deionized water.

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Abstract

Disclosed is an antistatic packing material, characterized in that the surface of the package base material is coated or fused by a layer of conductive polymer comprising the following materials (by weight percent): carbon powder 0.5-10%, polyamine ester 40-60%, addition agent 15-50%, solvent 15-40%, the addition agent comprises dispersing agent 2-15%, coupling agent 0.5-10%, thinning agent 12.5-35%.

Description

technical field [0001] The invention relates to a packaging material, in particular to an antistatic packaging material. Background technique [0002] Packaging materials are widely used in people's life and work, but different industries have different requirements for packaging materials. At present, the electronics industry is developing very rapidly, and many components or components are being gradually standardized, which involves packaging and transportation issues. These devices are very sensitive to static electricity, such as optical drive heads, integrated circuit module liquid crystals or other Components, etc., whether they are manufactured or transported, must be completed under dust-free or static-free conditions. Ordinary plastic films or sheets cannot meet the demand because they do not have electrical conductivity. How to give conductive properties to plastic film or sheet packaging? Most of the current treatment methods use surface treatment methods, that...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K3/16C09D175/04B05D7/02
Inventor 黄晖
Owner 黄晖
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