Insulating heat-dissipating coating and preparation method of same

Abstract

An insulating heat-dissipating coating and a preparation method of the same, wherein the insulating heat-dissipating coating includes following components: 50-65 parts of an organic silicone resin, 12-20 parts of a diluent, 1-3 parts of nano titanium dioxide, 0.5-0.8 parts of triallyl isocyanurate, 4-5 parts of a phosphrous titanate coupling agent, 4-5 parts of carbon nano tube, 0.2-0.5 parts of graphene, 2-3 parts of copper sulfate, 2-3 parts of sodium metasilicate and 8-10 parts of a curing agent. The preparation method includes following steps: 1) preparing the raw materials according to the mass ratio and mixing the organic silicone resin with the diluent to form a resin mixture; 2) mixing the resin mixture with the carbon nano tube and stirring the resin mixture with the carbon nano tube uniformly at normal temperature to form a coating (I); 3) mixing the coating (I) with the graphene with uniform stirring at normal temperature to form a coating (II); 4) mixing the coating (II) with the nano titanium dioxide, the triallyl isocyanurate, the phosphrous titanate coupling agent, the copper sulfate and the sodium metasilicate with uniform stirring at normal temperature to form a coating (III); and 5) mixing the coating (III) with the curing agent with uniform stirring to obtain the insulating heat-dissipating coating and allowing the insulating heat-dissipating coating to stand for 20 min for later use.

Description

technical field [0001] The invention relates to an insulating heat-dissipating paint and a preparation method thereof. Background technique [0002] With the advent of the Industry 4.0 era, the electronic information industry is an important support for the gorgeous upgrade of the manufacturing industry. Modern electronic equipment is highly integrated, and the temperature rise of components and circuits will lead to thermal deformation and thermal failure of the equipment. Therefore, the heat dissipation capability of the product seriously affects its performance and life. [0003] For the heat dissipation of electronic products, active and passive heat dissipation methods are often used. Active heat dissipation mainly adopts the method of installing fans, but its practicality is limited due to reasons such as mechanical vibration and mechanical noise in some workplaces. In passive heat dissipation, natural convection heat dissipation combined with radiation heat dissipat...

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Problems solved by technology

Active heat dissipation mainly adopts the method of installing fans, but its practicality is limited due to the lack of mechanical vibration and mechanical noise in some workplaces

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