Device and method for fixing machined thin plate based on bonding principle in milling machining
A milling and processing technology, applied in the field of manufacturing and processing, can solve the problems of low processing accuracy, high processing cost, difficult operation, etc., and achieve the effects of improving the yield, firm bonding and ensuring processing accuracy.
Pending Publication Date: 2018-06-29
西安创联超声技术有限责任公司
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[0009] The invention provides a device and method for fixing thin plates to be processed based on the bonding principle in milling processing, which solves the problems of low processing precision, difficult operation, high processing cost and high reject rate of thin plate milling devices and methods in the prior art
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[0028] In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0029] It should be noted that the "processed thin plate" and "thin plate" in the present invention refer to a plate with a thickness less than or equal to 40mm; when the thickness of the plate is greater than 40mm, there will be a certain processing risk in the device and method of the present invention; "milling ” means that this processing method is only applicable to various milling machine tools.
[0030] The basic principle of the...
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The invention relates to a device and method for fixing a machined thin plate based on a bonding principle in milling machining. The device comprises a milling machine tool, a machining auxiliary table surface, a special thin film type adhesive tape and a special band double-sided adhesive tape are arranged on a machine tool working table surface of the milling machine tool in sequence from bottomto top, and the machined thin plate is arranged on the upper end face of the special band double-sided adhesive tape. According to the principle of the device and method for fixing the machined thinplate based on the bonding principle in milling machining, the machining auxiliary table surface is fixedly arranged on the machine tool working table surface, a horizontal bonding datum surface is milled on the upper end face of the machining auxiliary table surface, and the machined thin plate is bonded on the machining auxiliary table surface through an adhesive mode and then is subjected to milling machining. According to the device and method for fixing the machined thin plate based on the bonding principle in milling machining, all milling machining modes that organic nonmetal and metalthin-plate parts and thin-plate parts are classified according to a mode that the allowance is removed can be achieved, the machining precision of the machined parts is ensured, the step that the machined thin plate is pressed and subjected to transposition in the milling machining of traditional thin-plate parts is omitted, and the problem that deformation of the parts is caused by pressing force, and consequently waste products are produced is solved.
Description
technical field [0001] The invention belongs to the technical field of manufacturing and processing, and in particular relates to a device and method for fixing thin plates to be processed based on the bonding principle in milling processing. Background technique [0002] Among the various methods for processing thin plate parts in the prior art, there is a lack of a milling method that fixes the processed thin plate based on the principle of bonding. [0003] The methods for processing thin plate parts in the prior art include: laser cutting method, electric discharge cutting method, milling method based on sucker sucking and fixing the thin plate, and milling method based on pressing plate to fix the thin plate. [0004] Before describing the processing methods for processing thin plate parts in the prior art, the thin plate parts are classified here according to the way of removing the allowance, which can be divided into the type that penetrates the cavity along the thic...
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IPC IPC(8): B23Q3/08
CPCB23Q3/065B23Q3/084
Inventor 张毅锋张秀莉刘兰艳陈晓庆杨璐
Owner 西安创联超声技术有限责任公司