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Image quality detection method of a photolithography machine

A detection method and technology of a lithography machine, applied in the field of semiconductors, can solve problems such as affecting production efficiency, and achieve the effects of reducing time consuming, increasing the frequency of monitoring, and avoiding losses

Active Publication Date: 2020-10-16
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

If the frequency of monitoring is to be strengthened, it will inevitably affect production efficiency

Method used

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  • Image quality detection method of a photolithography machine
  • Image quality detection method of a photolithography machine
  • Image quality detection method of a photolithography machine

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Embodiment 1

[0067] Refer below figure 1 and Figure 2a-2e The image quality detection method of the lithography machine of the present invention is described in detail, figure 1 A process flow diagram showing the image quality detection method of the lithography machine according to the present invention; Figure 2a-2e A schematic diagram of the process of the image quality detection method of the lithography machine according to the present invention is shown.

[0068] The invention provides a method for detecting image quality of a lithography machine, such as figure 1 As shown, the main steps of the method include:

[0069] Step S1: providing a wafer, on the surface of which is formed a number of hole patterns spaced apart from each other;

[0070] Step S2: performing defect scanning on the hole pattern to obtain a defect image;

[0071] Step S3: Analyzing the defect image to determine whether there is any abnormality in the defect image, and regularly monitor whether the imaging ...

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Abstract

The invention provides an image quality detection method for a photoetching machine. The method comprises the steps of providing a wafer, forming a plurality of mutually spaced hole patterns in the surface of the wafer, scanning the defect of the hole pattern to obtain a defect image; and analyzing the defect image to judge whether the defect image is abnormal, so as to monitore whether an imagingplane of a camera lens of the photoetching machine is abnormal at regular intervals. The method increases the monitoring frequency, no down machine is needed, the time consumed on monitoring is shortened, the detection method is higher in sensitivity, the problem is discovered timely when the imaging plane of the photoetching machine becomes abnormal on the initial stage, and the loss of the product yield is avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an image quality detection method of a photolithography machine. Background technique [0002] The imaging quality of the lithography machine directly affects key performance indicators such as CD uniformity, overlay accuracy, focal depth, and exposure latitude of the lithography machine. Therefore, the on-site detection technology of the imaging quality of the lithography machine is indispensable. [0003] Focus calibration using alignment (FOCAL) technology is an image quality inspection technology for high-resolution lithography machines, which can detect the best image plane, image plane tilt, field curvature, image Astigmatism and other image quality parameters. [0004] FOCAL technology is to sequentially image a special marking pattern - FOCAL marking pattern on silicon wafers at different defocus planes under the optimal exposure dose. Different from the alignme...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70633G03F7/7065
Inventor 邢滨柏耸
Owner SEMICON MFG INT (SHANGHAI) CORP