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Power module having dual-sided cooling

A power module, double-sided cooling technology, used in transportation and packaging, electronic commutation motor control, circuits, etc., can solve problems such as breakage, expensive silicon nitride, and deterioration of thermal characteristics, to prevent breakage, improve cooling performance, The effect of expanding the heat dissipation area

Pending Publication Date: 2018-06-29
HYUNDAI MOTOR CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] However, we have found that since silicon nitride (Si 3 N 4 ) is relatively expensive and exposes the outside of the sealing member 80, so it is easy to be damaged by external impact
[0014] In addition, it is difficult to bond the insulating layer 96 to the electrodes 91, 92, 93, 94 using the thermal grease 60, and when the thermal grease 60 is not evenly applied, the thermal characteristics deteriorate rapidly

Method used

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Embodiment Construction

[0038] The following description is merely exemplary in nature and is not intended to limit the invention, application or use. It should be understood that throughout the drawings, corresponding reference numerals indicate like or corresponding parts and features.

[0039] The terminology used herein is for the purpose of describing specific embodiments only, and is not intended to limit the present invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It will be further understood that when used in this specification, the terms "comprising", "comprising", "having" and the like designate the presence of stated features, integers, steps, operations, elements, ingredients and / or combinations thereof, but The presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof is not excluded.

[0040] Unless o...

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PUM

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Abstract

A power module having dual-sided cooling is provided with a semiconductor chip between an upper board and a lower board of the power module. In particular, the upper board includes: a first bonding layer made of a dielectric material, and a first electrode made of a copper material and provided on a first surface of the first bonding layer, and the first electrode is connected to the semiconductorchip. The lower board includes: a second bonding layer made of a dielectric material, and a second electrode made of a copper material and provided on a first surface of the second bonding layer, andthe second electrode is connected to the semiconductor chip. More specifically, a thickness of the first electrode is greater than a thickness of the first bonding layer, and a thickness of the second electrode is greater than a thickness of the second bonding layer.

Description

technical field [0001] The present invention generally relates to power modules with double-sided cooling. Background technique [0002] The statements in this section merely provide background information related to the present disclosure and may not constitute prior art. [0003] Generally, in order to operate a drive motor of a green car such as a hybrid car or an electric car, it is necessary to properly transmit current supplied from a high voltage battery to a power module of the drive motor. [0004] Such power modules generate considerable heat due to fast switching operations. Since such heat generation reduces the efficiency of the power module, a cooler for cooling the power module is provided. [0005] In a power module with double-sided cooling, boards are respectively mounted on both surfaces of semiconductor chips (ie, IGBTs or MOSFETs) of the power module, and coolers are mounted outside the boards, thereby simultaneously cooling both sides of the boards. ...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/373
CPCH01L23/367H01L23/3736H01L2023/4025H01L23/3677H01L23/42H01L23/473B60L2240/425H01L2224/33H01L23/5385H01L23/3735H01L23/051H01L25/072Y02T10/64H01L2224/33181H01L2224/32225H01L23/057H01L23/15H01L23/3737H01L23/48B60L15/00H01L23/3675H01L23/5381H02P6/085
Inventor 朴准熙孙正敏
Owner HYUNDAI MOTOR CO LTD
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