Photo-hardening resin composition, sealing agent, electronic component and liquid crystal display unit

A resin composition and photocuring technology, applied in the direction of modified epoxy resin adhesives, sealing devices, adhesive additives, etc., can solve the problems of impairing the reliability of moisture resistance, the hardening of the light-shielding part, and the contamination of liquid crystals, etc.

Active Publication Date: 2018-07-03
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in order for the thermal radical polymerization initiator to efficiently generate radicals, the molecular weight must be relatively small. Although low-molecular compounds are easily dissolved in liquid crystals and have excellent reactivity, the thermal radical polymerization initiator itself will cause liquid crystals. polluting problem
[0007] In addition, when polycarboxylic acid is used, there is also the possibility of impairing the reliability of moisture resistance, and it may not be used depending on the application.
[0008] As mentioned above, although the development of the liquid crystal sealing agent has been actively carried out, a liquid crystal sealing agent having excellent light-shielding portion hardening properties and low liquid crystal contamination has not yet been realized.

Method used

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  • Photo-hardening resin composition, sealing agent, electronic component and liquid crystal display unit
  • Photo-hardening resin composition, sealing agent, electronic component and liquid crystal display unit
  • Photo-hardening resin composition, sealing agent, electronic component and liquid crystal display unit

Examples

Experimental program
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Effect test

Embodiment

[0105] Hereinafter, although an Example demonstrates this invention in more detail, this invention is not limited to an Example. In addition, "parts" and "%" herein are based on mass unless otherwise specified.

Synthetic example 1

[0107] According to JP 2016-531926 A, a compound represented by the following formula (A-1) was synthesized in the following manner to obtain component (A).

[0108]

[0109] Diphenyl sulfide was added to aluminum chloride in dichloromethane at 0 °C. Next, chloroacetyl chloride was added at 0°C, and stirred at room temperature for 2 hours to obtain a mixture. Aluminum chloride and 4-methylpentanoyl chloride were added to the mixture at 0° C., and stirred overnight to obtain a reaction mixture. After pouring the reaction mixture into ice water, the organic layer was extracted with dichloromethane. The organic layer was dried over magnesium sulfate and concentrated, and the residue was purified by column chromatography to obtain a compound of the following formula (2) as a white powder.

[0110]

[0111] The compound of the aforementioned formula (2) was added to acetone, potassium carbonate and salicylaldehyde were added, and the mixture was stirred under reflux for 3 h...

Embodiment 1

[0116] [Example 1, Comparative Example 1]

[0117] Mix the two components (B) in the ratio shown in Table 1 below, heat and dissolve the component (A) in Synthesis Example 1 at 90° C., cool to room temperature, and add components (C), (D), (E ), (F), and (H) were stirred, dispersed by a three-roll mill and filtered using a metal mesh (635 mesh) to prepare Examples 1 and 2 of the photocurable resin composition. In addition, Comparative Example 1 was prepared by changing the component (A) using the component (O).

[0118] [Tg(UV+heat hardening)]

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PUM

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Abstract

The invention relates to a resin composition hardened through light irradiation of ultraviolet rays or visible lights, and proposes a resin composition which is highly sensitive to light and can be fully hardened even through a low-energy light. The solution of the invention is to provide a photo-hardening resin composition including components: (A) an oxime compound having a furan structure in molecules and (B) a hardening compound.

Description

technical field [0001] The present invention relates to a photocurable resin composition used as a sealant for electronic parts. More specifically, it relates to a photocurable resin composition containing a compound having a specific structure in a molecule. Since this photocurable resin composition has good sensitivity even to low-energy light rays and has little outgassing, it is extremely useful as a sealing agent for electronic parts, especially as a sealing agent for displays. Background technique [0002] The photocurable resin composition is widely used for encapsulants for electronic components such as encapsulants for displays, encapsulants for solar cells, and semiconductor encapsulants. As for the sealing compound for displays, the sealing compound for liquid crystals, the sealing compound for organic electroluminescence displays, the adhesive agent for touch panels, etc. are mentioned, for example. What these materials have in common is that they have excellen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/10C09J11/04C09J11/06C09J11/08G02F1/1339
CPCG02F1/1339C09J11/04C09J11/06C09J11/08C09J163/10C08L2203/206C08L2205/03C08L2205/025C08L63/10C08L33/10C08K13/02C08K7/18C08K5/5435C08K5/378C09K3/1006C09K2200/0488C09K2200/0441C09K2003/1059C09K2200/0458
Inventor 远岛隆行太田英之菅原坚太
Owner NIPPON KAYAKU CO LTD
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