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Preparation method of liquid-state metal composite phase-change material

A technology of composite phase change materials and liquid metal, which is applied in the field of preparation of liquid metal composite phase change materials, can solve problems such as short circuit of electronic circuits, influence on normal operation of CPU, damage to CPU, etc., achieve efficient heat dissipation, satisfy heat dissipation, and prevent circuit short circuit problem effect

Inactive Publication Date: 2018-07-06
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the liquid metal can fully fill the micro-gap of the thermal interface, greatly improve the heat conduction rate of the heating element and the heat dissipation interface, and make the heat dissipation efficiency higher, but because the liquid metal is in a liquid state during operation, it is easy to cause short circuit problems in electronic circuits, which will directly Affect the normal operation of the CPU, or even damage the CPU

Method used

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  • Preparation method of liquid-state metal composite phase-change material
  • Preparation method of liquid-state metal composite phase-change material
  • Preparation method of liquid-state metal composite phase-change material

Examples

Experimental program
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Effect test

Embodiment example 1

[0020] (1) Preparation of flexible carbon nanotube sponge carrier material:

[0021] Mix 1g of polyvinylidene fluoride, 7g of sodium chloride and 0.2g of carbon nanotubes uniformly, then add them to a cylindrical mold, place in an oven at 200℃ for 4h, take out the product and immerse it in 90℃ hot water to completely dissolve the inside Sodium chloride, finally dried in a vacuum oven at 100°C for 24 hours to obtain a cylindrical flexible carbon nanotube sponge carrier material, where the flexibility is demonstrated as figure 1 As shown, SEM is like figure 2 As shown, TEM is like image 3 As shown, Raman Figure 4 Shown.

[0022] (2) Preparation of liquid metal composite phase change material:

[0023] The flexible carbon nanotube sponge carrier material prepared above was evacuated at 100° C. for 24 hours to completely open the internal pores. Then the vacuum treated carbon nanotube sponge carrier material and liquid metal Bi 45 Pb 23 Sn 8 Cd 5 In 19 At the same time, it is placed...

Embodiment example 2

[0025] (1) Preparation of flexible carbon nanotube sponge carrier material:

[0026] Mechanically mix 0.8g polyvinylidene fluoride, 5g sodium chloride and 0.3g carbon nanotubes, then add them to a square mold, place in a 220℃ oven for 2h, take out the product and immerse it in 80℃ hot water to completely dissolve it. The sodium chloride was finally dried in a vacuum oven at 120°C for 18 hours to obtain a square flexible carbon nanotube sponge carrier material.

[0027] (2) Preparation of liquid metal composite phase change material:

[0028] The flexible carbon nanotube sponge carrier material prepared above was evacuated at 100° C. for 18 hours to completely open the internal pores. Then the vacuum treated carbon nanotube sponge carrier material and liquid metal Bi 49 Pb 18 Sn 12 In 21 At the same time, it is placed in a vacuum flask and heated to 60℃ to melt it. In a vacuum environment, the liquid metal Bi 49 Pb 18 Sn 12 In 21 Adsorption is restricted in the pores, and then cooled...

Embodiment example 3

[0030] (1) Preparation of flexible carbon nanotube sponge carrier material:

[0031] Mix 0.6g polyvinylidene fluoride, 6g sodium chloride and 0.5g carbon nanotubes uniformly, then add them to a rectangular mold, place in an oven at 240℃ for 1h, take out the product and immerse it in 85℃ hot water for complete dissolution The sodium chloride inside was finally dried in a vacuum oven at 140°C for 20 hours to obtain a rectangular flexible carbon nanotube sponge carrier material.

[0032] (2) Preparation of liquid metal composite phase change material:

[0033] The flexible carbon nanotube sponge carrier material prepared above was evacuated at 100° C. for 20 hours to completely open the internal pores. Then the vacuum treated carbon nanotube sponge carrier material and liquid metal Bi 50 Pb 27 Sn 13 Cd 10 At the same time, it is placed in a vacuum flask and heated to 75°C to melt it. In a vacuum environment, the liquid metal Bi 50 Pb 27 Sn 13 Cd 10 Adsorption is restricted in the pores...

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Abstract

The invention provides a preparation method of a liquid-state metal composite phase-change material and belongs to the field of shaped composite phase-change materials. The preparation method comprises the following steps: firstly, uniformly mixing water-soluble metal salt, carbon nanotubes and a polyvinylidene fluoride raw material which have different ratios; putting a mixture into a mold with aspecific shape and drying; finally, dissolving metal salt in the mold in hot water to obtain flexible carbon nanotube sponge with a specific shape; putting a prepared flexible carbon nanotube spongecarrier material and liquid-state metal into a vacuum environment by adopting a melting impregnation method; selecting proper temperature to melt a liquid-state metal core material; adsorbing and limiting the liquid-state metal core material into a pore channel by utilizing the pore channel of the flexible carbon nanotube sponge carrier material under a vacuum environment; then cooling to obtain the liquid-state metal composite phase-change material. According to the preparation method provided by the invention, CPU (Central Processing Unit) efficient heat dissipation in different temperatureranges can be realized; controllable equipment of a pore channel structure is realized through changing types and ratios of raw material; the packaged shaped composite phase-change material can solvethe short-circuit problem, caused by free flowing of liquid-state metal, of an electronic element circuit; meanwhile, dynamic heat dissipation of flexible electronic components also can be met.

Description

Technical field [0001] The invention belongs to the field of shaped composite phase change materials, and specifically relates to a preparation method of a liquid metal composite phase change material. Background technique [0002] Electronic heat dissipation is related to the life and reliability of electronic equipment, and is a bottleneck affecting the development of today's electronics industry. With the development of the three major trends of high performance, miniaturization, and integration in the electronics industry, the problem of heat dissipation has become more and more prominent. Especially for chips with high thermal load sensitivity, the accumulation of heat at the chip will seriously affect its stability and service life. Studies have shown that if the operating temperature of a single electronic component is increased by 10°C, its reliability will be reduced by 50%; and the failure of the CPU is mostly caused by overheating. If the large amount of heat generat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/06
CPCC09K5/063Y02P20/10
Inventor 王戈陈晓高鸿毅董文钧邢立文王军勇陈思远郑海燕
Owner UNIV OF SCI & TECH BEIJING
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