Chip oxygen sensor and preparation method thereof

The technology of an oxygen sensor and a manufacturing method, which is applied in the field of oxygen sensors, can solve the problems of poor flexural strength of the sheet-type oxygen sensor, prone to cracks and warpage, complicated manufacturing process, etc., achieves easy printing and uniformity, and is beneficial to industrialized production and preparation. simple craftsmanship

Pending Publication Date: 2018-07-06
卢忠勇 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This prior art has the following defects: 1. When the first sheet and the third sheet are manufactured, printing is performed on a soft casting sheet, which requires an external supporting plate to support, and it is difficult to print evenly; 2. Since the first sheet, the second sheet and the third sheet are manufactured separately first, in order to make the sheets tightly bonded, the first sheet, the second sheet, and the third sheet must be laminated in the end. The chip oxygen sensor can only be obtained by hot pressing. The manufacturing process is relatively complicated, and it is prone to cracks and warping. The bending strength of the manufactured chip oxygen sensor is still relatively poor, and the yield rate is not high.

Method used

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  • Chip oxygen sensor and preparation method thereof
  • Chip oxygen sensor and preparation method thereof

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Embodiment 2

[0033] Embodiment 2 of the manufacturing method of the chip oxygen sensor, the steps are as follows:

[0034] The alumina ceramic substrate 4 that has been sintered into a dense body with a purity of 80% and a thickness of 0.5 mm is prepared, and the first insulating layer 3 is printed on one side of the ceramic substrate 4. The wet film thickness of the first insulating layer 3 printed is 30um, dry, then print the heating electrode 2, the wet film thickness printed on the heating electrode 2 is 20um, dry, then print the second insulating layer 1, the wet film thickness printed on the second insulating layer 1 is 30um, dry , and then sintering the ceramic substrate 4 at a high temperature of 1500° C. to form a heater base.

[0035] Continue to print the third insulating layer 5 on the same side of the ceramic substrate 4, the wet film thickness of the third insulating layer 5 printing is 30um, dry, and then print the first porous platinum electrode 6, and the first porous plat...

Embodiment 3

[0037] Embodiment 3 of the manufacturing method of the chip oxygen sensor, the steps are as follows:

[0038] The alumina ceramic substrate 4 that has been sintered into a dense body with a purity of 93% and a thickness of 0.635 mm is prepared, and the first insulating layer 3 is printed on one side of the ceramic substrate 4. The wet film thickness of the first insulating layer 3 printed is 80um, dry, then print the heating electrode 2, the wet film thickness printed on the heating electrode 2 is 60um, dry, then print the second insulating layer 1, the wet film thickness printed on the second insulating layer 1 is 100um, dry .

[0039] Print the third insulating layer 5 on the other side of the ceramic substrate 4, the wet film thickness of the third insulating layer 5 printing is 80um, dry, then print the first porous platinum electrode 6, the first porous platinum electrode 6 printing The wet film thickness is 60um, dry, and then print the reference layer 7, the wet film t...

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Abstract

The invention discloses a preparation method of a chip oxygen sensor and the chip oxygen sensor prepared by the method. The preparation method comprises the following steps: preparing a ceramic substrate sintered into a dense body to serve as a support body; sequentially printing a first insulating layer and drying the printed first insulating layer at one side of the ceramic substrate through a thick film printing mode, printing a heating electrode and drying the printed heating electrode and printing a second insulating layer and drying the printed second insulating layer at the other side of the ceramic substrate or on the second insulating layer through the thick film printing mode; sequentially printing a third insulating layer and drying the printed third insulating layer, printing afirst porous platinum electrode and drying the printed first porous platinum electrode, printing a reference layer and drying the printed reference layer, printing a second porous platinum electrodeand drying the printed second porous platinum electrode and printing a porous protection layer and drying the printed porous protection layer; and sintering the printed ceramic substrate at high temperature so as to be molded. The chip oxygen sensor disclosed by the invention has no need of being thermally pressed and is simple in process, less in deformation and cracks and high in finished product yield.

Description

technical field [0001] The invention mainly relates to the field of oxygen sensors, in particular to a method for manufacturing a chip oxygen sensor and the chip oxygen sensor. Background technique [0002] In the control system of the vehicle engine, ensuring that the engine works with the mixture of the best air-fuel ratio is a key technology for emission control. The vehicle oxygen sensor is a key component for controlling the air-fuel ratio of the engine mixture. The oxygen sensor is Feedback the gas condition after mixed combustion of oil and gas to a key component of the engine control unit (ECU) in real time. The engine electronically controlled injection system precisely controls the air-fuel ratio (A / F, the mass ratio of air to gasoline) based on the signal provided by the oxygen sensor. . Therefore, the oxygen sensor is an indispensable component in the use of the three-way catalytic conversion engine. When the air-fuel ratio of the mixture deviates from the theo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/409
CPCG01N27/409
Inventor 卢忠勇王建农韦修厦刘挺梁森森谭明伟
Owner 卢忠勇
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