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A Method for Analyzing Accelerated Interface State Defect Formation During Device Ionizing Radiation Damage

A technology of ionizing radiation and interface state, which is applied in the direction of single semiconductor device testing, instrumentation, and electrical measurement, and can solve problems affecting damage mechanism analysis, accelerating interface state, defects, etc.

Active Publication Date: 2020-05-26
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The present invention solves SiO 2 In the process of analyzing the ionizing radiation damage mechanism of electronic components as insulating materials and passivation layers, radiation-induced oxides capture positive charges and interface state defects simultaneously produce problems that affect the analysis of damage mechanisms. A method for analyzing ionizing radiation of electronic components is proposed Methods to Accelerate the Formation of Interface State Defects During Damage Mechanisms

Method used

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  • A Method for Analyzing Accelerated Interface State Defect Formation During Device Ionizing Radiation Damage
  • A Method for Analyzing Accelerated Interface State Defect Formation During Device Ionizing Radiation Damage
  • A Method for Analyzing Accelerated Interface State Defect Formation During Device Ionizing Radiation Damage

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specific Embodiment approach 1

[0033] Specific implementation mode 1: In this implementation mode, the method for accelerating the formation of interface state defects in the process of analyzing the ionizing radiation damage mechanism of electronic components is carried out according to the following steps:

[0034] 1. Determine the chip thickness a of the sample of electronic components;

[0035] 2. Determine the type and energy of incident particles:

[0036] Using Geant4 software, input the type of incident particles and the energy of the radiation source of the input particles, and calculate the incident depth d of the incident particles in the device; if d≤4a, re-change the energy of the radiation source or re-select the type of incident particles, and use Geant4 software Calculate the incident depth d of incident particles in the device to ensure that d>4a;

[0037] 3. Calculate ionization absorbed dose I d and the displaced absorbed dose D d:

[0038] Use Geant4 software to calculate the ionizat...

specific Embodiment approach 2

[0048] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the electronic components described in step 1 use SiO 2 Bipolar process electronic components as insulating material and passivation layer. Other steps and parameters are the same as those in the first embodiment.

specific Embodiment approach 3

[0049] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the radiation source in step 2 is incident particles. Other steps and parameters are the same as those in Embodiment 1 or 2.

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Abstract

The invention discloses a method for accelerating formation of interface state defects in process of analyzing an ionizing radiation damage mechanism of an electronic element appliance, and relates toa method for accelerating formation of interface state defects. The method aims to solve the problem that the radiation induced oxide capturing positive charge and of interface state defects generateinfluences on the analysis of the damage mechanism at the same time during the analysis process of the ionizing radiation damage mechanism of the electronic element appliance using SiO2 as the insulation material and a passivation layer. The method includes steps of calculating ionization / displacement absorbing dosage and injection depth of unit injection incident particles; according to the proportional relationship of the ionization and displacement absorbing dosages, setting the dosage rate of the incident particles, radiating according to the order of high first and low later. The methodaccelerates the formation of interface state defects, separates the formation processes of the oxide capturing positive charge and the interface state defects, and separately studies the influence ofthe oxide capturing positive charge or the interface state defects. The method is applicable to analyze the ionizing radiation damage mechanism of the electronic element appliance.

Description

technical field [0001] The invention relates to a method for accelerating the formation of interface state defects. Background technique [0002] With the development of science and technology, my country's aerospace industry has made great progress and has become one of the aerospace powers. All kinds of spacecraft are closely related to our life and safety. Electronic components used in spacecraft will inevitably be affected by the space environment during their in-orbit service. These factors include solar cosmic ray particles, galactic cosmic ray particles, and radiation environments such as the Earth's radiation belts. Electronic components play a vital role in the electronic control system and information system of a spacecraft. Various radiation environments in space can lead to performance degradation, abnormal function or even failure of electronic components. [0003] The radiation environment will cause oxide positive charges and interface state trap defects ins...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/26
CPCG01R31/2601
Inventor 李兴冀陈伟杨剑群郭晓强王晨辉刘超铭
Owner HARBIN INST OF TECH