A Method for Analyzing Accelerated Interface State Defect Formation During Device Ionizing Radiation Damage
A technology of ionizing radiation and interface state, which is applied in the direction of single semiconductor device testing, instrumentation, and electrical measurement, and can solve problems affecting damage mechanism analysis, accelerating interface state, defects, etc.
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specific Embodiment approach 1
[0033] Specific implementation mode 1: In this implementation mode, the method for accelerating the formation of interface state defects in the process of analyzing the ionizing radiation damage mechanism of electronic components is carried out according to the following steps:
[0034] 1. Determine the chip thickness a of the sample of electronic components;
[0035] 2. Determine the type and energy of incident particles:
[0036] Using Geant4 software, input the type of incident particles and the energy of the radiation source of the input particles, and calculate the incident depth d of the incident particles in the device; if d≤4a, re-change the energy of the radiation source or re-select the type of incident particles, and use Geant4 software Calculate the incident depth d of incident particles in the device to ensure that d>4a;
[0037] 3. Calculate ionization absorbed dose I d and the displaced absorbed dose D d:
[0038] Use Geant4 software to calculate the ionizat...
specific Embodiment approach 2
[0048] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the electronic components described in step 1 use SiO 2 Bipolar process electronic components as insulating material and passivation layer. Other steps and parameters are the same as those in the first embodiment.
specific Embodiment approach 3
[0049] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the radiation source in step 2 is incident particles. Other steps and parameters are the same as those in Embodiment 1 or 2.
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