The invention relates to the technical field of
aerospace optical device packaging, in particular to an anti-
irradiation photo-thermal dual-curing conductive
adhesive and a preparation method thereof. Comprising the following components in parts by weight: 10-30 parts of
epoxy resin, 1-5 parts of a thermal initiator, 2-4 parts of a
photoinitiator, 30-75 parts of modified
powder, 0-3 parts of a
coupling agent, 5-10 parts of an
epoxy reactive diluent and 0-10 parts of a
flame retardant, the modified
powder is prepared by modifying a mixture of a conductive filler, a metallic
carbon nanotube and a nano
metal oxide by using a modifier. According to the conductive
adhesive, the modified
powder is added into the conductive
adhesive, so that the problem of compatibility of a formula can be solved, warping of the conductive adhesive is effectively reduced, the
conductivity of the conductive adhesive is also improved, and meanwhile, the metallic carbon nanotubes form a coaxial circular
tube structure by carbon atoms arranged in a hexagonal manner, so that cosmic rays can be absorbed, and the
conductivity of the conductive adhesive is improved. The conductive filler and the nano
metal oxide powder can fill the gaps between the circular tubes and form a compact structure, and
radiation particles can be effectively blocked, so that the
radiation resistance of the conductive adhesive is remarkably improved, and the durability and reliability of the
optical module in a starry
sky environment are greatly improved under the condition of ensuring
chip packaging and bonding.