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42 results about "Bipolar process" patented technology

Power integration module for air conditioner and manufacturing method of power integration module

The invention discloses a power integration module for an air conditioner and a manufacturing method of the power integration module. The power integration module comprises a substrate; a first to third upper bridge arm switch tubes and a first to third lower bridge arm switch tubes, which are all arranged on the substrate; a first to three high and low voltage drive tubes which are disposed on the substrate and are used for respectively driving the first to third upper and lower bridge arm switch tubes to operate, wherein the first high-voltage driving tube, the second high-voltage driving tube and the third high-voltage driving tube are achieved through the BCD or SOI process of the first voltage, and the first, second and third low-voltage driving tubes are achieved through the BCD or Bipolar process of the second voltage. The power integration module is configured on the corresponding switching tubes through the independent high-voltage driving tubes and low-voltage driving tubes,so as to enable the paths from the high-voltage driving tubes and low-voltage driving tubes to the grid electrodes of the corresponding switching tubes to be consistent, thereby guaranteeing the consistency of the dynamic characteristics of the switching tubes effectively, greatly saving the area of circuit wiring, greatly reducing the area of a circuit substrate of the intelligent power module, and reducing the cost.
Owner:GD MIDEA AIR-CONDITIONING EQUIP CO LTD +1

Low-noise operational amplifier circuit

The invention discloses a low-noise operational amplifier circuit. The low-noise operational amplifier circuit comprises an amplifier circuit, and an amplifier comprises an input-stage circuit, an intermediate-stage circuit and an output-stage circuit. The input stage circuit adopts a differential pair transistor structure to improve input impedance, reduce offset voltage and temperature drift, establish a good matching direct current working point and finish buffering and first stage amplification of input voltage; the intermediate-stage circuit adopts a folding common-base-stage common-emitter-stage structure to improve voltage gain and output swing; the output-stage circuit adopts triodes with the same parameters to output in a push-pull manner to expand internal current, so that the post-stage driving capability is improved, and the output swing is increased. According to the invention, the input voltage noise is optimized by changing the size of the resistor, and the polycrystalline silicon trimming replaces the laser trimming of the metal film resistor, so that the characteristic of high precision of the circuit is realized. According to the circuit structure, the noise performance can be improved, and the circuit structure can be compatible with an existing anti-radiation standard bipolar process.
Owner:XIAN MICROELECTRONICS TECH INST

Test method for coordination effect of displacement damage and total ionization dose of bipolar process electronic device

ActiveCN113156291AAchieve the worst evaluationAchieving Performance Test PredictionSemiconductor operation lifetime testingNeutron irradiationGamma ray
In order to highlight the characteristics of the coordination effect of the displacement damage and the total ionization dose of the bipolar process electronic device, the invention provides a test method for the coordination effect of the displacement damage and the total ionization dose of the bipolar process electronic device, which comprises the following steps of: firstly, irradiating the bipolar process electronic device by using gamma rays; in the irradiation process, a corresponding device adopting one of a variable-temperature irradiation mode and a constant-high-temperature irradiation mode, and performing irradiation until the required ionization total dose level is reached; and then irradiating the irradiated electronic device to a specified value by using reactor neutrons, whererin in the irradiation process, no bias is applied to the device and pins are in short-circuiting; and after neutron irradiation, testing the electrical parameters of the device after the amount of the surface active agent of the device is reduced to a safety threshold. According to the method, the combined action of oxide trapped charges, interface traps and displacement damage defects can be emphasized, so that conservative evaluation of the displacement damage and ionization total dose coordination effect of the bipolar process electronic device in a complex radiation environment is realized.
Owner:NORTHWEST INST OF NUCLEAR TECH

Manufacture method of all-dielectric isolation silicon on insulator (SOI) material sheet for complementary bipolar process

A manufacture method of an all-dielectric isolation silicon on insulator (SOI) material sheet for a complementary bipolar process comprises of the steps of manufacturing an N-type buried layer and a P-type buried layer on a first monocrystalline wafer, performing deep-trench etching, sacrificial layer oxidation, trench resistor oxidation and deposition trench filling of polycrystalline silicon and corrugated metal pipe (CMP) polycrystalline silicon on the first monocrystalline wafer to form a dielectric isolation region; arranging a buried oxide layer on a second monocrystalline wafer; performing front silicon bonding of the first monocrystalline wafer with the formed dielectric isolation region and the second monocrystalline wafer with the formed buried oxide layer; and performing reduction and CMP finishing polish of a substrate on the side of the first monocrystalline wafer, and finally forming the all-dielectric isolation SOI material sheet for the complementary bipolar process. The manufacture method has the advantages of being low manufacture cost, few in active layer defects, good in active layer parameter consistency, free of figure drifting and the like, and can be widely applied to the manufacture field of the all-dielectric isolation complementary bipolar process.
Owner:NO 24 RES INST OF CETC

Dual polycrystal self-aligned complementary bipolar device structure and fabrication method thereof

The invention provides a dual polycrystal self-aligned complementary bipolar device structure and a fabrication method thereof. Process development of a 0.35micron technology node is achieved under the condition of a 6inch process line, namely on the process line of photoetching the technology node with the minimum linewidth of 0.5micron; fabrication of a complementary bipolar process device which can only be achieved under a higher technology level is achieved under the premise of not increasing equipment budget of the higher technology level of the 6inch process line; the actual minimum process dimension reaches 0.3-0.35micron; the device performance is not reduced, namely various technical indexes of a device all reach the technology level under the 0.35micron technology node and the characteristic frequency of the device employing an NPN tube and a PNP tube reaches the magnitude of gigahertz; and on the basis of high structure symmetry of the longitudinal NPN tube and PNP tube and high symmetry of device characteristics, a technology platform and an important guarantee are provided for improving the design capability of a push-pull circuit. Due to the adoption of the 6inch process line, the actual process fabrication cost is effectively reduced.
Owner:NO 24 RES INST OF CETC

Bandgap reference starting circuit and method for wide power supply range based on radiation-resistant bipolar technology

The invention provides a band gap reference starting circuit and method based on a radiation resistance double-pole technology and used for a wide power source range. It is ensured that when power supply is low, normal work of the band gap reference circuit is not influenced, and the circuit is applied to the wide power source range. The circuit comprises the band gap reference circuit and a starting circuit body which are connected; the starting circuit body is composed of a Zener diode D1, a resistor R1, a first double-pole transistor set and a second double-pole transistor set. By means ofthe starting method, the difference of breakdown voltage BV of the Zener diode D1 and junction voltage of triodes Q1, Q4 and Q16 can generate current irrelevant to power source voltage and with a certain temperature coefficient on resistors R2 and R3. As to the circuit, through R6, a triode Q6 and a triode Q7, compensation current with the temperature coefficient opposite to that of the current isgenerated, and after the two pieces of current flow through a triode Q13, reference current with temperature compensation properties is finally formed, then flows out of a collector of a pipe 15 through the mirror image effect of a triode Q14 and is provided for other circuit modules.
Owner:XIAN MICROELECTRONICS TECH INST

Improved method of semiconductor integrated general operational amplifier without resistor and amplifier thereof

The invention discloses an improved method of a semiconductor integrated general operational amplifier without a resistor and an amplifier thereof. A two-terminal device CRD (Current Regulator Diode), which is compatible with a bipolar process, directly replaces all kinds of constant current source circuits which are always used currently in a circuit. The semiconductor integrated general operational amplifier without the resistor is composed of a pre-stage circuit, an intermediate-stage circuit and a final-stage circuit. No resistance elements exist in a new circuit, and the whole circuit is simple in structure, standard in form, the pre-stage circuit and the intermediate-stage circuit are symmetric, the number of used components is greatly reduced, the size of a CRD device is much smaller than that of an integrated resistor, the integration density is improved and the power consumption is reduced; no negative feedbacks exist in the whole circuit, and the transient response of the circuits is improved greatly; and for final output, over-current protection is not required, so that even if an output end is short-circuited, the whole circuit is not damaged, thereby improving the security.
Owner:贵州煜立电子科技有限公司

Over-temperature protection circuit of bipolar linear voltage regulator

The invention discloses an over-temperature protection circuit of a bipolar linear voltage regulator and belongs to the field of over-temperature protection. The over-temperature protection circuit of the bipolar linear voltage regulator is composed of a temperature sensor circuit, a sampling feedback circuit and an output circuit. According to the over-temperature protection circuit of the bipolar linear voltage regulator, the current feedback loop is introduced, so the circuit has a temperature hysteresis characteristic, problems that the protected circuit is frequently started at a temperature protection point, the junction temperature of a chip cannot be fully reduced and the circuit cannot return to a normal working state are solved, and the over-temperature protection circuit is suitable for low power supply voltage; by adopting the over-temperature protection circuit disclosed by the invention, whether the junction temperature of the bipolar linear voltage regulator and other analog circuit chips exceeds a safe working area or not can be accurately identified. The circuit is designed and realized by adopting a bipolar process, the circuit structure is simple, the number of used components is small, and the physical design area is small.
Owner:XIAN MICROELECTRONICS TECH INST

Technique for preparing bipolar type long-direction NPN tube using phosphorus-buried and deep phosphorus-buried technique

The bipolar longitudinal NPN tube manufacturing process using phosphorus burying and deep phosphorus burying technologies is a process method for using the phosphorus burying and deep phosphorus burying technologies in the manufacturing process for the phosphorus burying and deep phosphorus burying technologies, for the purpose of reducing saturated pressure drop of NON tube and enhancing the circuit output power. The bipolar longitudinal NPN tube manufacturing process using phosphorus burying and deep phosphorus burying technologies means using phosphorus burying and deep phosphorus burying technologies in the bipolar process for manufacturing the NPN tube. The area when using phosphorus burying and deep phosphorus burying technologies is the same as the area when using common antimony burying technical chip, the extra chip area is not required and only the processes are different from each other. Material sheet using the phosphorus burying and deep phosphorus burying technologies to manufacture the NPN tube is P-type <111> crystallographic direction, resistance rate is 10 to 20 Omega.cm, and after using the deep phosphorus burying technology, the concentration and volume when the deep phosphorus is diffused too deep can be efficiently compensated owing to the upward turning effect of the deep phosphorus burying, thus settling the bottleneck problem about larger resistance at the contact position of the deep phosphorus and burying layer.
Owner:WUXI YOUDA ELECTRONICS

Bipolar process-based integrated circuit with ultralow offset voltage

The invention discloses a bipolar process-based integrated circuit with an ultralow offset voltage. With the method of the invention adopted, the offset problem of a bipolar process-based double-input-to-single-output conversion integrated circuit system can be solved. According to the integrated circuit of the invention, a double-input-to-single-output conversion matching technology is adopted; and a base current compensation technology and a current load compensation technology are combined; and therefore, the influence of the base current of a bipolar device on system offset is reduced. Theoutput end of a double-input-to-single-output conversion matching circuit is connected with a base current compensation circuit; the base current compensation circuit is connected with the double-input-to-single-output conversion matching circuit; and a current load compensation circuit is connected with the double-input-to-single-output conversion matching circuit and the base current compensation circuit. With the integrated circuit of the invention adopted, the influence of the base current of a bipolar transistor on the offset of the circuit system is reduced, and the matching precision of the circuit is improved; the gain of the circuit is improved; and current matching is not affected by large current output. The integrated circuit is widely applied to bipolar process-based preciseoperational amplifiers, low-offset comparators and high-precision AD/DA devices and other related fields.
Owner:GUIZHOU ZHENHUA FENGGUANG SEMICON

Method for manufacturing deep trench and pn junction hybrid isolation structure for high-speed bipolar process

The invention provides a production method of a deep groove and PN junction mixed isolation structure for a bipolar technology. The method comprises the steps that a mask is arranged on a substrate silicon chip; an etching window running through the mask is arranged on the mask, the substrate silicon chip on the lower layer of the etching window is etched through the etching window, and a deep groove is formed; impurities whose doping type is opposite to that of bulk silicon are injected into the deep groove to form a groove bottom isolation PN junction; the mask is peeled off, and ONO composite film is prepared on the surface of the bulk silicon and in the deep groove; polycrystalline silicon is deposited to fill the deep groove; silicon oxide on the top layer of the ONO film outside thedeep groove is removed, and the remaining silicon nitride-silicon oxide structure is utilized to form an active area. According to the production method of the deep groove and PN junction mixed isolation structure for the bipolar technology, the stress in the groove is smartly balanced by means of the ONO structure on the inner wall of the deep groove, meanwhile the silicon nitride-silicon oxide structure is served as a masking layer of active area oxidation, extra production process of the masking layer during production of the active area is avoided, the production cost of the process is effectively reduced, and the isolation effect is improved.
Owner:NO 24 RES INST OF CETC
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