Method for enhancing welding effect of QFN package and QFN package

A packaging size, low-level technology, applied in the direction of electrical components, electrical solid devices, semiconductor/solid device manufacturing, etc., can solve the problems of IC chips that are not stable enough, the welding quality is average, and the welding effect is poor, so as to enhance the welding effect. , ensure stability and safety, and increase the effect of welding area

Inactive Publication Date: 2018-07-06
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Claims
  • Application Information

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Problems solved by technology

However, in practical applications, since the pins of QFN packaged IC parts are on the back side, there is only a plane space when soldering, and the welding effect is very poor due to the compression of the body of the IC parts. In the prior art, the process technology is generally only It can ensure that the welding area coverage on the back of IC parts in QFN package reaches about 50%, so the welding quality is very general, which will lead to unstable operation of IC chips

Method used

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  • Method for enhancing welding effect of QFN package and QFN package
  • Method for enhancing welding effect of QFN package and QFN package

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Embodiment Construction

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For Those of ordinary skill in the art can also obtain other drawings based on these drawings without making creative efforts.

[0017] Based on the above, on the one hand, embodiments of the present invention provide a method for enhancing the soldering effect of QFN packages, with figure 1 It is a perspective view of the front and back of the QFN in the prior art, with figure 2 It is a perspective view of the front and back of the QFN of the present invention, and the method includes:

[0018] Step 1, adding a shrinkage structure layer at the bottom of the QFN package, and the bottom shrinkage structure layer is smaller than the normal package s...

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Abstract

The invention provides a method for enhancing the welding effect of a QFN (Quad Flat No-lead) package and a QFN package. An inward structure layer is formed at the bottom of the QFN package, and the very bottom is slightly smaller than the normal package size. A height difference is formed between the bottom structure layer and the sub-bottom layer in order to form a tin climbing channel. During welding, the bottom structure layer is welded with tin, and tin can climb to the sub-bottom and the side of the sub-bottom in order to increase the welding area and tin content and enhance the qualityof parts welding of the QFN package. The problem of poor welding due to the fact that the pins of QFN package parts are all at the bottom is solved. The welding quality and reliability of QFN packageparts are ensured. Therefore, the stability and safety of products are ensured.

Description

technical field [0001] The invention relates to the technical field of server motherboards, in particular to a method for enhancing the welding effect of QFN packaging and QFN packaging. Background technique [0002] With the popularization of personal computers and the development of various data clouds, the application range of servers and personal computers is increasing. In this way, there are more and more motherboards for servers and personal computers, and more and more IC components are used. Due to the limited space on the motherboard, there are fewer and fewer ICs with conventional pin packages. Now the basic mainstream IC components use QFN ( Quad Flat No-lead Package (Quad Flat No-lead Package) is a leadless package. However, in practical applications, since the pins of QFN packaged IC parts are on the back side, there is only a plane space when soldering, and the welding effect is very poor due to the compression of the body of the IC parts. In the prior art, t...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L23/488
CPCH01L21/50H01L23/488
Inventor 于浩
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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