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A DMD-based 3D grayscale image exposure optimization method for lithography machine

A grayscale image and optimization method technology, applied in microlithography exposure equipment, image coding, optomechanical equipment, etc., can solve the problems of low exposure efficiency, improve grayscale scanning exposure efficiency, reduce bandwidth limitations, and achieve high compression than the effect

Active Publication Date: 2020-04-17
HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Exposure is very inefficient due to bandwidth limitations for data transfer

Method used

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  • A DMD-based 3D grayscale image exposure optimization method for lithography machine
  • A DMD-based 3D grayscale image exposure optimization method for lithography machine
  • A DMD-based 3D grayscale image exposure optimization method for lithography machine

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Embodiment Construction

[0020] The present invention will be further described below in conjunction with accompanying drawing:

[0021] Such as figure 1 A kind of DMD-based lithography machine 3D grayscale image exposure optimization method shown, the method comprises the following steps:

[0022] (1) Perform grayscale image preprocessing on the graphics data to obtain the data to be processed. The grayscale image preprocessing includes segmentation, rasterization and grayscale value assignment transformation.

[0023] (2) according to formula B=(((J+N-1) / N)+T-1) / (T), determine the quantity of suitable thread number and thread block; Wherein, B represents the quantity of thread block; J Indicates the number of bytes of data to be processed; N indicates the number of bytes processed by each thread, the value range of N is limited by the shared memory of the graphics card, and the experience value is generally 16 or 32; T indicates the number of threads.

[0024] (3) Process the data to be processed...

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Abstract

The invention relates to a DMD-based photoetching machine 3D gray level image exposure optimization method. The method comprises the following steps of (1) performing gray level image preprocessing onimage data to obtain to-be-processed data; (2) determining a proper thread count and the number of thread blocks according to a formulas that B is equal to (((J+N-1) / N)+T-1) / T, wherein B represents the number of thread blocks, J represents the number of bytes of to-be-processed data, N represents the number of bytes processed by each thread, and T represents the thread count; (3) performing segment processing on the to-be-processed data; and (4) performing recombination on the segment processed data, and sub-ducting invalid data. The DMD gray level exposure image is subjected to pixel compression by CUDA through an upper computer, and the compressed data is transmitted by a network interface, so that the bandwidth limitation of data transmission is lowered, and the gray level scanning exposure efficiency of the photoetching machine is improved.

Description

technical field [0001] The invention relates to the technical field of direct writing photolithography equipment, in particular to a DMD-based photolithography machine 3D grayscale image exposure optimization method. Background technique [0002] 3D grayscale exposure technology is a hot spot in the field of lithography in recent years. Due to the need to produce complex devices with continuous surface microstructures, grayscale exposure is generally based on a grayscale mask with a certain grayscale, and the grayscale The higher the value, the smoother the microstructure of the device surface. Masks with grayscale are very complicated to manufacture and expensive. DMD-based lithography (laser direct writing) technology has been gradually applied to the research of grayscale exposure technology due to its low cost and high performance. DMD-based lithography machine 3D grayscale image exposure adopts scanning exposure method, and DMD (digital micromirror device) image scroll...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G06T9/00G06T1/20
CPCG03F7/70508G06T1/20G06T9/00
Inventor 许成军
Owner HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
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