Circuit board with symmetrical heat radiation structure and computing device

Abstract

The embodiment of the invention provides a circuit board with a symmetrical heat radiation structure and a computing device. First cooling fins of first surfaces of the circuit boards are the same assecond cooling fins of second surfaces of the circuit boards in dimension. According to the embodiment of the invention, by taking the consideration of an aspect of a cooling path of a computing device, the dimensions of the cooling pins of the front and back surfaces of the circuit boards are optimized, the windage resistances of air channels at the front and front surfaces of the circuit boardsare effectively balanced to allow the temperatures of different circuit boards in a computing device cabinet to be consistent, and the temperature difference of chips arranged at the front and back surfaces of the cabinet is reduced so as to achieve an optimization heat radiation effect.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of computing equipment, in particular to a circuit board with a symmetrical heat dissipation structure and computing equipment. Background technique [0002] In the existing artificial intelligence (AI) solutions, in order to meet the accelerated processing requirements of large-scale data computing, technicians use multiple processing chips to form a series structure to build AI computing accelerator boards, and use multiple accelerator boards to form high-speed Performance computing equipment, which greatly improves the computing and processing capabilities for artificial intelligence [0003] In the prior art, for this multi-chip series structure, in order to make each chip dissipate heat in time and ensure the heat dissipation effect, the Chinese invention patent application CN201710936285.3 proposes a circuit board chip heat dissipation scheme, such as figure 1 As shown, the circuit...

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Problems solved by technology

[0005] However, in order to ensure the heat dissipation effect of the first side of the PCB carrying the chip in the above heat dissipation scheme, the size of the heat sink on the first side carrying the chip is designed to be higher than the size of the heat sink on the second side, and it is located on the PCB board. The radiator on the second side has denser fins than the radiator on the first side, which will cause the wind resistance of the air duct-L on the back of the PCB in the chassis to be greater than that of the front air duct-R, so it is very It is difficult to balance the temperature difference between different PCB boards and different chips on different PCB boards, which will lead to the existence of local overheated PCB boards or chips, and the excessive temperature difference between the front and rear sides of the chassis, which limits the whole machine The upper temperature limit affects the computing performance of the whole machine

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