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Method and related device for determining tool interference area in single-point diamond turning

A diamond tool, single-point diamond technology, applied in the field of turning processing, can solve the problems of reducing the surface quality and accuracy of the workpiece

Active Publication Date: 2020-10-30
SHENZHEN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, when the rake face of the diamond tool is higher than the spindle axis of the workpiece, a central conical interference area will be formed on the surface of the workpiece, which will reduce the surface quality and accuracy of the workpiece

Method used

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  • Method and related device for determining tool interference area in single-point diamond turning
  • Method and related device for determining tool interference area in single-point diamond turning
  • Method and related device for determining tool interference area in single-point diamond turning

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0023] The terms "first", "second", "third" and "fourth" in the specification and claims of the present application and the drawings are used to distinguish different objects, rather than to describe a specific order . Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed ste...

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Abstract

The embodiments of the present invention disclose a method for determining a cutter interference region during single-point diamond turning. The method is characterized in that a cutter is a diamond cutter; the diamond cutter includes a rake face, a flank face and a cutting edge; the cutting edge is a portion where the rake face and the flank face intersect with each other; the flank face is conical; and the cutting edge is fan-shaped. The method includes the following steps that: the trajectory equation of the cutting edge in a first coordinate system is determined; the surface equation of the flank face in the first coordinate system is determined according to the trajectory equation of the cutting edge; and the relational expression of the radius of an interference region in a second coordinate system is determined according to the trajectory equation and the surface equation. With the method provided by the embodiments of the present invention adopted, the radius of the interference region can be determined, cutting parameters can be adjusted, and the surface precision of a workpiece can be improved.

Description

technical field [0001] The present application relates to the technical field of turning, and in particular to a method and a related device for determining a tool interference area in single-point diamond turning. Background technique [0002] Single-point diamond turning is a turning process using single-crystal diamond as a cutting tool. Because natural diamond has nano-scale edge sharpness and good wear resistance, it can be used to cut ultra-high-quality surfaces and prepare nano-scale surface finishes. Rotational symmetry optical products with sub-micron shape accuracy are widely used in optics, aerospace, laser, military equipment and communication and other fields. [0003] At present, when the rake face of the diamond tool is higher than the spindle axis of the workpiece, a central cone interference area will be formed on the surface of the workpiece, which will reduce the surface quality and precision of the workpiece. invention content [0004] The technical pr...

Claims

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Application Information

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IPC IPC(8): G05B19/19B23B1/00
CPCB23B1/00G05B19/19G05B2219/35349
Inventor 张国庆戴玉琦
Owner SHENZHEN UNIV
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