16 results about "Diamond turning" patented technology

The application relates to the technical field of single-point diamond turning, in particular to a method for estimating the influence of a single-point diamond turning tool mark diffraction on image quality, which comprises the following steps: designing an optical system and modeling a tool mark diffraction surface as a phase diffraction annular grating in the optical system; calculating an amplitude spread function of light rays after the light rays pass through the optical system and reach an image plane; respectively calculating diffraction efficiencies of different diffraction orders under the amplitude spread function of the same wavelength, and superimposing the amplitude spread functions after the amplitude spread functions are normalized to the corresponding diffraction efficiencies; calculating a complex color intensity spread function based on the amplitude spread functions of different wavelengths; and obtaining a modulation transfer function after image quality is reduced based on the complex color intensity spread function, so that a design index can be effectively comprehensively evaluated, processing test cost is reduced, and a production cycle is shortened.

The utility model relates to the technical field of grinding devices, in particular to an automatic grinding device for a curved-edge diamond turning tool, which comprises a rack and a grinding mechanism arranged on the rack, the grinding mechanism comprises a tool setting mechanism, a main shaft mechanism, a CCD (Charge Coupled Device) detection mechanism and a powder coating mechanism, the turning tool is driven to move in the Y-axis direction through the Y-axis moving assembly; the main shaft mechanism is used for driving a grinding wheel on the main shaft mechanism to grind a turning tool, the grinding wheel is moved through X-axis and Z-axis coordinates, and then it is guaranteed that curve machining can be conducted on the turning tool in combination with Y-axis coordinates of the tool setting mechanism. The CCD detection mechanism and the tool setting mechanism move synchronously and are used for shooting and detecting the tool setting and machining process of the turning tool. The powder coating mechanism is used for coating the grinding wheel with powder, and normal operation of grinding work is guaranteed.

The invention relates to a tool holder device, a method and a tool for operating an object, in particular for single point diamond turning (SPDT). A tool holder apparatus generally includes: a tool holder including: a base; a tool support extending from the base; a seat for a tool, the seat being provided on the tool support wherein the tool is positionable in the seat in use; a sensor device configured, in use, to generate an electrical measurement signal representing at least or associated with at least a force applied to the tool; and a piezoelectric actuator arrangement comprising at least one piezoelectric actuator, the at least one piezoelectric actuator being operably connected to the tool support, the at least one piezoelectric actuator is configured to, in use, displace the tool support, or at least a portion thereof, in response to receiving a suitable electrical control signal, thereby maintaining, in use, a desired force applied to the tool.

The invention discloses a fused quartz lens manufacturing method based on a partially degreased silicon nano composite material. The fused quartz lens manufacturing method mainly comprises three steps of preparation of the partially degreased silicon nano composite material, single-point diamond turning and high-temperature degreasing and sintering. The preparation method comprises the following steps: firstly, dispersing nano silicon dioxide powder into an organic solvent to prepare silicon dioxide slurry, obtaining a partially degreased silicon nano composite material through photocuring and partial degreasing, then forming a high-precision complex structure by using single-point diamond turning, and finally performing high-temperature degreasing and sintering in a muffle furnace to obtain the transparent and compact fused quartz lens. According to the method, through partial degreasing, stress existing in the material during light curing is released, deformation in the high-temperature degreasing and sintering process is greatly reduced, meanwhile, the excellent cutting machining performance of the material is reserved, and high-precision manufacturing of the complex fused quartz optical element is achieved.

The invention discloses a method for determining a path of a diamond turning tool with a large-gradient rotational symmetry surface shape. The method comprises the following steps of: firstly, dividing a curvilinear equation of a processing object into a series of discrete data points according to an equal arc length method or an equal interval method and the like; then, calculating unit normal vectors corresponding to the discrete points according to a curvilinear equation; and then, mapping the measured surface shape error to a curvilinear equation of a processed object according to a unit normal vector of a corresponding point, and finally, adding cutter radius compensation on a cutter path according to the unit normal vector of the corresponding point, and outputting a processing program according to a machine tool numerical control program format. According to the method for determining the path of the diamond turning tool, the number of times of surface shape compensation of single-point diamond turning can be reduced, the convergence speed is increased, particularly for a large-gradient surface shape, the surface shape convergence speed is higher than that of a conventional diamond turning tool, and the machining precision and the machining efficiency of the whole process are improved on the whole.

The invention relates to the technical field of millimeter wave communication, in particular to a V / W wave band low-loss metal waveguide and a preparation method thereof. According to the preparation method provided by the invention, metal additive manufacturing, inner wall conductive metal deposition, ultra-smooth inner surface polishing and external single-point diamond turning technologies are combined, so that the waveguide manufactured by a composite process chain is high in yield; comprising an aluminum-magnesium (zirconium) alloy waveguide structure manufactured through laser beam melting additive manufacturing, a copper (silver) inner wall coating deposited through a chemical reduction plating technology, an inner wall surface with the roughness lower than 50 nm Ra through abrasive flow machining, and a self-alignment flange with the flatness lower than 0.1 micron and the butt joint surface roughness lower than 20 nm Ra through ultra-precision machining. And the electrical performance, the thermal interface consistency and the assembly precision are improved. According to the preparation method, the problems of high price-mode coupling, uncontrollable inner wall roughness and the like caused by high insertion loss and large structure assembly error of the existing waveguide structure in high-frequency application are solved.

The invention discloses a method for rapidly manufacturing a small-caliber silicon carbide reflector substrate, which comprises the following steps of: determining an optical surface type of a target reflector according to a design drawing of the target reflector, processing a concave surface type consistent with the surface type of the reflector on the surface of a die by adopting a single-point diamond turning technology, and forming the small-caliber silicon carbide reflector substrate by utilizing a glass die forming technology. Carrying out hot press molding on a thermoplastic resin material in the mold to obtain a convex surface type polishing head complementary to the surface type of the reflecting mirror, attaching the polishing head to a silicon carbide reflecting mirror blank, injecting a polishing solution, keeping the reflecting mirror blank fixed, driving the polishing head to rotate at a high speed, and carrying out surface contact type polishing on the surface of the reflecting mirror blank to obtain the silicon carbide reflecting mirror. And the surface quality of the polished reflector blank is detected, if the surface quality does not reach the standard, the mold is reprocessed according to the measured surface type, the method is repeated until the processing requirement is met, the special polishing heads complementary with the reflector surface type are prepared in batches through die forming, and the problem that the efficiency is low due to the fact that the sizes of the polishing heads are limited for the small-caliber reflectors is solved.

The invention discloses a Fresnel lens photoetching processing method which comprises the following steps: step A, designing a three-dimensional model of a Fresnel lens according to design requirements of the Fresnel lens; b, plane projection is carried out according to the three-dimensional model of the Fresnel lens, and a projection mapping relation is obtained; the projection mapping relation comprises coordinate positions in a projection plane and height values corresponding to the coordinate positions; step C, according to the height value corresponding to each coordinate position, determining the depth of the structure needing to be photoetched at each coordinate position; step D, converting to form a photoetching parameter file according to the depth of the structure needing to be photoetched at each coordinate position; and step E, carrying out photoetching according to the photoetching file information, and developing the photoetching offset plate subjected to photoetching to obtain the photoetching offset plate with a Fresnel lens pattern. According to the method, the three-dimensional image of the Fresnel lens can be obtained in a photoetching mode, and an original precision diamond turning micromachining means can be replaced.

A method for turning free-form surfaces based on B-axis control of uniform tool wear includes: (1) preparation stage: setting tool parameters, surface quality requirements and effective cutting edge discretization model; (2) offline path planning stage: generating tool contact points based on Archimedes spiral, combining surface normal angle and virtual wear accumulation array, dynamically selecting the cutting edge with the least wear, calculating the corresponding B-axis rotation angle and updating the wear state; (3) online machining stage: performing tool center coordinate compensation, generating X, Z, C, B four-axis linkage NC code, driving the machine tool to complete the machining; This invention actively controls the B-axis posture, transforming tool wear from local concentration to uniform distribution across the entire cutting edge, significantly extending tool life, improving the machining accuracy and consistency of free-form surfaces, and is particularly suitable for single-point diamond turning of optical components such as off-axis parabolic surfaces.

According to the back thinning and polishing preparation method for the infrared focal plane array chip assembly, indium columns are evenly distributed between the lower surface of an indium antimonide chip and the upper surface of a circuit, and filling glue is poured between the lower surface of the indium antimonide chip and the upper surface of the circuit in a vacuum mode; the back thinning and polishing preparation method comprises the steps of inverted interconnection, epoxy glue filling and curing, quartz substrate bonding, single-point diamond turning, chemical mechanical polishing, cleaning and corrosion. According to the method, a single-point turning machining mode is adopted, so that damage and crack are not generated, pit-shaped point stress damage is not generated, the PV value is smaller than 1 micron, the machining process is controllable, a traditional downward pressurization grinding mode is changed, the difficulties of pressurization cracking and non-uniform thickness faced by module surface type warping are overcome, and the method can be widely applied to infrared focal plane array chips.

This invention discloses an ion beam processing method for visible light aluminum mirrors based on an improved shaping strategy, comprising the following steps: 1) correcting the surface shape error of the aluminum mirror using a single-point diamond turning process; 2) correcting the surface shape error of the aluminum mirror corrected by the single-point diamond turning process using a magnetorheological process; 3) obtaining the surface shape error matrix R of the aluminum mirror corrected by the magnetorheological process. mrf and the amount of material removed r during magnetorheological processing m Based on the amount of material removed r m Calculate the contamination layer removal residence time matrix T in the residence time matrix of ion beam processing. c According to the surface error matrix R mrf Calculate the matrix removal residence time matrix T in the residence time matrix of ion beam processing. s The aluminum reflector, after being corrected using magnetorheological technology, is processed using an ion beam process using the aforementioned residence time matrix. This invention improves the ion beam shaping strategy to further enhance surface accuracy.

This invention relates to the field of advanced laser manufacturing and optical inspection, specifically to a method and system for monitoring the temperature field of a single-point diamond cutting region using laser in situ assistance. The method includes the following steps: S1, inducing plasma generation in the processing area using a pulsed laser and acquiring a spatiotemporal resolved image of the plasma luminescence region; S2, extracting morphological feature parameters and corresponding spectral intensity data from the spatiotemporal resolved image of the plasma luminescence region in S1; S3, inputting the morphological feature parameters from S2 into a pre-calibrated temperature mapping model to calculate the two-dimensional temperature distribution of the processing area; S4, confirming the location and temperature rise rate of abnormal temperature distribution areas based on the two-dimensional temperature distribution in S3, and generating real-time optimization commands for laser power and scanning path to achieve monitoring of the temperature field in the diamond cutting region.

The application relates to a method for designing machining parameters and tool parameters of ultrasonic vibration assisted cutting of a single crystal silicon optical element, and belongs to the technical field of optical manufacturing. Single crystal silicon is a typical hard and brittle difficult-to-machine material, and it is difficult to machine a high-precision crack-free smooth complex curved surface on the single crystal silicon by using conventional ultraprecision manufacturing technology. Moreover, it is difficult to machine a large-aperture optical element due to the rapid wear of a diamond tool. In the application, the numerical values of crack projection length and maximum tolerance length at the critical undeformed chip thickness or the maximum undeformed chip thickness of the single crystal silicon material in ultrasonic vibration assisted diamond turning of the single crystal silicon are calculated and compared, whether a smooth crack-free surface can be obtained is evaluated, and the machining parameters and tool parameters suitable for being adopted when the smooth crack-free surface can be obtained are calculated and analyzed. The application has important value in improving the surface quality and machining efficiency of the single crystal silicon in ultrasonic vibration assisted diamond turning.

Systems and methods for a cost-effective, high-performance optical lens for head mounted displays (HMDs) or other applications. The lens assembly combines a thin lens with microfeatures on at least one transmission surface, and a thicker lens with a curved surface, allowing for plano-convex or bi-convex configurations. Both lenses have mounting areas with complementary microfeatures on their peripheries, facilitating their coupling and self-alignment within low tolerances. These microfeatures, including the mounting ones, can be generated using a high-precision process like diamond turning, thereby ensuring precision in alignment and function.

This invention relates to a method for confirming the virtual center position of an ultra-precision machine tool based on straight groove cutting. The workpiece and a diamond turning tool are fixed on the C-axis and B-axis of the ultra-precision machine tool, respectively. The workpiece is turned to eliminate Z-axis tool setting errors. After tool setting is completed using a tool setter, the initial virtual center position is recorded, and the diamond turning tool is controlled to plan the first straight groove. The virtual center function is activated, and the B-axis is rotated by an angle α, controlling the diamond turning tool to plan the second straight groove. Then, the B-axis rotation angle is adjusted to -2α, controlling the diamond turning tool to plan the third straight groove. The depth of the three straight grooves is measured along the Z-axis and recorded. The angle θ between the initial virtual center, the actual virtual center, and the B-axis rotation center, as well as the distance L' from the actual virtual center to the B-axis rotation center, are calculated to confirm the position of the actual virtual center. When machining complex feature structures, this invention can greatly improve the efficiency of toolpath programming, effectively reduce machining path deviations, and improve the surface quality of ultra-precision machining.