Substrate table system and method for improving growth uniformity of diamond film by using same
A diamond film and substrate table technology, applied in metal material coating process, gaseous chemical plating, coating and other directions, can solve the problem of unsatisfactory diamond film growth uniformity, difficult substrate temperature distribution, excessive metal impurities and other problems, to achieve the effects of easy timely control, efficient temperature distribution, and simple processing technology.
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[0039] Example 1:
[0040] A method for improving the uniformity of diamond film growth, specifically including the following steps:
[0041] S100, the processing and assembly of the substrate table system:
[0042] Choose the cold water pipe 1 with a diameter of 8mm, and arrange the pipes in the center area where the substrate stand 3 and the substrate table 4 are connected with the water pipe spacing of 2.5mm. Choose the cold water pipe 1 with a diameter of 5mm and arrange the water pipes at a distance of 4mm. In other areas where the substrate stage holder 3 and the substrate stage 4 are connected, the area where the 8mm water cooling pipe 1 is arranged occupies 1 / 4 to 1 / 2 of the total area (the area of the substrate stage 4), and the 5mm water cooling pipe 1 The proportion of the arranged area is 1 / 2 to 3 / 4 of the total area (the area of the substrate table 4). The brazing filler 2 is used to fill the gap between the water-cooled tube 1 and the substrate table support 3, whe...
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[0047] Example 2:
[0048] A method for improving the uniformity of diamond film growth, specifically including the following steps:
[0049] S100, the processing and assembly of the substrate table system:
[0050] Choose the cold water pipe 1 with a diameter of 10mm, arrange the pipes in the center area where the substrate stand 3 and the substrate table 4 are connected with the water pipe spacing of 1.5mm, choose the cold water pipe 1 with a diameter of 6mm, and arrange the water pipes at a distance of 3mm In other areas where the substrate stage holder 3 and the substrate stage 4 are connected, the area where the 10mm water cooling pipe 1 is arranged occupies 1 / 4 to 1 / 2 of the total area (the area of the substrate stage 4), and the 6mm water cooling pipe 1 The proportion of the arranged area is 1 / 2 to 3 / 4 of the total area (the area of the substrate table 4). The brazing filler 2 is used to fill the gap between the water-cooled tube 1 and the substrate table support 3, where...
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