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Substrate processing device, control method thereof, and computer-readable storage medium

A substrate processing device and processing liquid technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of large-scale and complex substrate processing devices, and achieve the effects of simple structure, spatter suppression, and defect suppression

Active Publication Date: 2022-03-08
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, for example, with the installation of a camera system for monitoring, there is a possibility of complicating and increasing the size of the substrate processing equipment.

Method used

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  • Substrate processing device, control method thereof, and computer-readable storage medium
  • Substrate processing device, control method thereof, and computer-readable storage medium
  • Substrate processing device, control method thereof, and computer-readable storage medium

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Embodiment Construction

[0158] Embodiments of the present invention will be described below based on the drawings. In the drawings, parts having the same structures and functions are denoted by the same symbols, and repeated explanations will be omitted in the following description. In addition, the drawings are schematic, and the dimensions, positional relationships, and the like of various structures in each drawing are not shown accurately.

[0159]

[0160]

[0161] figure 1 It is a schematic plan view showing an example of a schematic configuration of the substrate processing apparatus 1 of the first embodiment. The substrate processing apparatus 1 is, for example, a single-wafer type apparatus capable of performing various processes by supplying a processing liquid to the surface of a semiconductor substrate (wafer) as an example of a substrate W. Various treatments include, for example, chemical solution treatment for etching with a chemical solution, cleaning treatment for removing con...

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Abstract

The present invention provides a substrate processing apparatus, its control method, and a computer-readable storage medium, which can suppress the occurrence of defects when discharging a processing liquid from a nozzle to a substrate with a relatively simple structure. The substrate processing apparatus includes a nozzle, a piping unit, a valve, an activation unit, a control unit, and a detection unit. The nozzle discharges the processing liquid toward the substrate. The piping part forms a flow path of the treatment liquid connected to the nozzle. The valve is provided in the middle of the piping section, and changes the state of the processing liquid in the piping section and the nozzle. The drive unit gives the valve a driving force to operate the valve. The control unit outputs a trigger signal to actuate the valve through the activation unit. The detection unit detects a specific state. The control unit calculates the setting related to the operating speed of the valve action caused by the triggering unit based on the relationship between the actual operating time and the reference operating time from the first timing when the trigger signal is output to the second timing when the detecting unit detects a specific state. Amount of change.

Description

technical field [0001] The invention relates to a substrate processing device, a control method of the substrate processing device and a computer-readable storage medium. The substrates to be processed include, for example, semiconductor substrates, substrates for liquid crystal display devices, substrates for plasma displays, substrates for FED (Field Emission Display, field emission displays), substrates for optical discs, Substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, substrates for solar cells, etc. Background technique [0002] In the substrate processing apparatus, the supply path of the processing liquid to the nozzle is opened and closed by a discharge valve provided in the middle of a pipe connected to the nozzle. Thereby, discharge of the processing liquid from the nozzle to the substrate is started and stopped. [0003] In such a substrate processing apparatus, a phenomenon in which the process...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67023H01L21/67051H01L21/6708H01L21/6715H01L21/67253H01L21/67242H01L21/02052
Inventor 中井仁司
Owner DAINIPPON SCREEN MTG CO LTD
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