A composite material chip and chip holder
A technology of combining material chips and reaction chambers, applied to laboratory containers, chemical instruments and methods, and supporting appliances, etc., can solve the problems of long residence time, poor evaluation results, and increased probability of reverse reaction of active components To achieve the effect of improving the safety factor, improving the accuracy of high-throughput evaluation, and reducing the probability of reverse reactions
Active Publication Date: 2020-08-28
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology
However, the existing combined material chip can only meet the general material chip characterization method. When it is used in the evaluation process of gas-solid two-phase reaction activity, the residence time of the reaction product generated on the combined material chip is too long, which further increases the relationship with the chip. Probability of reverse reaction of the active component, making the evaluation result poor
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[0021] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0022] This example aims at CO 2 The three-way catalyst for the catalytic hydrogenation system (taking Cu-ZnO-ZrO as an example) designed a three-way composite material chip suitable for high-throughput physical vapor deposition equipment, and made it more suitable for gas phase deposition by changing the substrate structure of the ZnO chip. Solid-state two-phase catalyzed reaction.
[0023] Design a combined material chip (equal triangle) with a uniform through-hole structure to ensure that the reactive gas (CO 2 +H 2 ) fully contact with the catalytically active components on the chip, and at the same time pass through the through hole on the material chip in time to discharge the reactor, reduce the probability of reaction air resistance and reverse reaction, and improve the safety factor and safety factor of gas-solid two-phase reaction ...
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Abstract
The invention belongs to the field of material gene combination material chip design and gas-solid two-phase catalytic reaction, and specifically relates to a combined material chip and a chip support, which are suitable for gas-solid two-phase catalytic reaction and the corresponding activity evaluation system reactor. The present invention perforates the structure of the combined material chip, on the basis of more sufficient contact between the reaction gas and the active material, reduces the internal air resistance of the reactor, improves the safety factor of the reaction system, and makes it more suitable for Gas-solid two-phase reaction process. And for the reaction chamber of the fixed bed reactor, a composite material chip support is designed to fix the position of the composite material chip. At the same time, the reaction products are discharged in time to reduce the probability of reverse reactions, thereby improving the accuracy of high-throughput evaluation of the activity of catalytic materials.
Description
technical field [0001] The invention belongs to the field of material gene combination material chip design and gas-solid two-phase catalytic reaction, and specifically relates to a combined material chip and a chip support, which are suitable for gas-solid two-phase catalytic reaction and the corresponding activity evaluation system reactor. Background technique [0002] Traditional material science is an experimental science that needs to be synthesized one by one and tested one by one. Time-consuming and laborious synthesis methods restrict the speed of material innovation. Therefore, the field of materials science is constantly exploring to find more efficient experimental methods. In the 1970s, in the process of researching superconducting materials, Hanak first proposed the concept of combined materials to improve the experimental throughput. He used the co-sputtering method to synthesize a complete binary or ternary combined material at one time, and performed a sampl...
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IPC IPC(8): B01L3/00G01N31/10B01L9/00
CPCB01L3/502707B01L9/527B01L2200/12B01L2200/148B01L2300/0887G01N31/10
Inventor 向勇张晓晴史家远张晓琨
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA