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A laser processing method for hard and brittle materials

A laser processing method and technology of hard and brittle materials, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of affecting the appearance of the workpiece, increasing the process and energy consumption, sacrificing processing efficiency, etc., and achieving significant technical effects. Effect of shortening processing time and optimizing processing efficiency

Active Publication Date: 2020-02-07
SUZHOU TUSEN LASER
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The quality and efficiency of laser processing are always important evaluation factors in the technology of laser processing hard and brittle materials. Defects such as edge burrs and chipping not only affect the appearance of the workpiece, but may also lead to a significant decrease in the strength of the workpiece and increase the safety hazards during the use of the workpiece
[0004] In order to optimize the processing quality, reduce edge chipping, and improve burrs, etc., the optimization of laser processing technology is mostly achieved by adding air blowing devices, reducing laser energy, and reducing processing speed. However, these methods often improve cutting quality. Sacrifice processing efficiency, or increase process and energy consumption

Method used

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  • A laser processing method for hard and brittle materials

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Embodiment one: see figure 1 Shown, a kind of laser processing method of hard and brittle material comprises the following steps:

[0024] (1) Place the material to be processed on the workbench, the level of the workbench should be high, and the height difference is less than 20um; provide a laser light source with tunable pulse width, and adjust the laser focus to focus on the upper surface of the material to be processed;

[0025] (2) Adjust the laser pulse width at 1.5ns to obtain a short pulse laser, use the short pulse laser to process the surface material, and cut a cutting line on the first surface, and the depth D1 of the cutting line is controlled at 0.1mm;

[0026] (3) Adjust the pulse width at 7ns to obtain a long pulse laser, and use the long pulse laser to continue processing along the cutting line, with a processing depth D2 until the thickness D3 from the second surface is controlled at 0.1mm;

[0027] (4) Adjust the laser pulse width to obtain a short ...

Embodiment 2

[0028] Embodiment two: see figure 1 Shown, a kind of laser processing method of hard and brittle material comprises the following steps:

[0029] (1) Place the material to be processed on the workbench, the level of the workbench should be high, and the height difference is less than 20um; provide a laser light source with tunable pulse width, and adjust the laser focus to focus on the upper surface of the material to be processed;

[0030] (2) Adjust the pulse width of the laser to 1ns to obtain a short pulse laser, use the short pulse laser to process the surface material, and cut a cutting line on the first surface, and the depth D1 of the cutting line is controlled at 0.08mm;

[0031] (3) Adjust the pulse width to 6ns to obtain a long pulse laser, and use the long pulse laser to continue processing along the cutting line, the processing depth D2, until the thickness D3 from the second surface is controlled at 0.05mm;

[0032] (4) Adjust the laser pulse width to obtain a s...

Embodiment 3

[0033] Embodiment three: see figure 1 Shown, a kind of laser processing method of hard and brittle material comprises the following steps:

[0034] (1) Place the material to be processed on the workbench, the level of the workbench should be high, and the height difference is less than 20um; provide a laser light source with tunable pulse width, and adjust the laser focus to focus on the upper surface of the material to be processed;

[0035] (2) Adjust the pulse width of the laser to 0.5ns to obtain a short-pulse laser, use the short-pulse laser to process the surface material, and cut a cutting line on the first surface, and the depth D1 of the cutting line is controlled at 0.05mm;

[0036] (3) Adjust the pulse width at 4.5ns to obtain a long pulse laser, and use the long pulse laser to continue processing along the cutting line, and the processing depth D2 until the thickness D3 from the second surface is controlled at 0.05mm;

[0037] (4) Adjust the laser pulse width to o...

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Abstract

The invention discloses a laser machining method of a hard and brittle material. The laser machining method comprises the following steps: (1) a laser light source with tunable pulse width is provided; and a laser focal point is adjusted to focus on a first surface of a material to be machined; (2) a laser pulse width is adjusted within 0.02-2 ns to obtain short pulse laser; the short pulse laseris adopted to machine a surface-layer material; a cutting way is formed in the first surface; and a depth D1 of the cutting way is not lower than 0.2 mm; (3) the pulse width is adjusted within 4-10 nsto obtain long pulse laser; and the long pulse laser is adopted to continuously machine along the cutting way until a distance from a thickness D3 of a second surface is not lower than 0.2 mm; and (4) the laser pulse width is adjusted to obtain short pulse layer; and the remained thickness D3 is machined by the short pulse layer to finish laser machining. The laser machining method is few in collapsed edge formed in machining and short in machining time, and optimizes overall machining efficiency.

Description

technical field [0001] The invention relates to a laser processing method, in particular to a laser processing method for hard and brittle materials. Background technique [0002] Glass, quartz, sapphire and other hard and brittle materials are widely used in construction, optics, electronics and other fields, and are extremely common materials in daily life. The processing and cutting of such hard and brittle materials is an indispensable link in material application. [0003] Laser processing, as a green and environmentally friendly processing technology, is an important technology in the processing of hard and brittle materials. Laser processing of hard and brittle materials is to focus energy on the focus of the laser, so that the material in and around the focus area is partially blasted, and the blasting area is superimposed with the movement of the laser point, and the material processing is finally completed. The quality and efficiency of laser processing are always...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/304B23K26/38B23K26/0622
CPCB23K26/0622B23K26/0626B23K26/38
Inventor 蒋仕彬
Owner SUZHOU TUSEN LASER