Vertical type silicon wafer magnetron sputtering film plating machine

Abstract

The invention discloses a vertical type silicon wafer magnetron sputtering film plating machine. The vertical type silicon wafer magnetron sputtering film plating machine comprises a vacuum chamber, atransmission device, a vacuum-pumping system and a power supply control system, wherein the transmission device is arranged in the vacuum chamber and is used for hanging and moving silicon wafers, the vacuum-pumping system is used for carrying out vacuumizing, and the power supply control system is used for supplying power and controlling a working condition; the vacuum chamber comprises a washing chamber and a sputtering chamber which are hermetically connected mutually, an ion cleaning electrode is arranged in the washing chamber, and a sputtering target is arranged in the sputtering chamber; the transmission device comprises a silicon wafer hanging plate, a hanging plate base and a rail car which are arranged in the vacuum chamber, the silicon wafer hanging plate is detachably connected with the hanging plate base, a groove is formed in the top of the rail car, a bulge portion is formed on the bottom of the hanging plate base, and the hanging plate base is in fixed inserting connection with the rail car through the matching between the bulge portion and the groove. By adopting the design, the volume of the vacuum chamber can be reduced, the vacuum effect is good, the silicon wafers are conveniently picked and placed, residues can be effectively removed from surfaces of the silicon wafers, the silicon wafers can be effectively heated, and film-plated wafers are good in effect.

Description

technical field [0001] The invention relates to the field of vacuum coating, in particular to a vertical magnetron sputtering coating machine for silicon wafers. Background technique [0002] The vertical magnetron sputtering coating machine for silicon wafers is used to coat silicon wafers with one or more layers of metal film using magnetron sputtering targets in a vacuum environment. To move, the top of the conventional transmission track is flat, and the silicon wafer placement plate is directly placed on the track to move. In order to maintain a balance, both the track and the silicon wafer placement plate must be designed wider, resulting in a wider width of the vacuum chamber. In this way, the volume of the vacuum chamber increases, and the vacuum effect is not good, which affects the coating effect; there is also a problem that the entire silicon wafer placement plate needs to be taken out from the vacuum chamber to place the silicon wafer and take the silicon wafer....

AI Technical Summary

Problems solved by technology

[0002]Vertical magnetron sputtering coating machine for silicon wafers is used to coat silicon wafers with one or more layers of metal films using magnetron sputtering targets in a vacuum environment , the silicon wafer placement plate that hangs the silicon wafers moves in the vacuum chamber using a transmission device. The top of the conventional transmission track is flat, and the silicon wafer placement plate is directly placed on the track to move. In order to maintain balance, both the track and the silicon wafer placement plate must be designed Wider, the width of the vacuum chamber must also be designed wider, so that the volume of the vacuum chamber increases, the vacuum effect is not good, and the coating effect is affected; there is also a problem that the entire silicon wafer needs to be placed and removed. The placing plate is taken out from the vacuum chamber, which is inconvenient when the size of the silicon wafer placing plate is large

[0003]In addition, there are generally gas residues or other stains attached to the silicon wafer. If the stains are not removed during coating, the coating will be uneven, and the quality of the resulting film will be poor. , the ionization electrode can be used to ionize the gas to clean the surface of the silicon wafer. However, the traditional design of the ion cleaning electrode does not have a good heat dissipation effect and the equipment failure rate is high.

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