The invention discloses a vertical type silicon wafer magnetron sputtering film plating machine. The vertical type silicon wafer magnetron sputtering film plating machine comprises a vacuum chamber, atransmission device, a vacuum-pumping system and a power supply control system, wherein the transmission device is arranged in the vacuum chamber and is used for hanging and moving silicon wafers, the vacuum-pumping system is used for carrying out vacuumizing, and the power supply control system is used for supplying power and controlling a working condition; the vacuum chamber comprises a washing chamber and a sputtering chamber which are hermetically connected mutually, an ion cleaning electrode is arranged in the washing chamber, and a sputtering target is arranged in the sputtering chamber; the transmission device comprises a silicon wafer hanging plate, a hanging plate base and a rail car which are arranged in the vacuum chamber, the silicon wafer hanging plate is detachably connected with the hanging plate base, a groove is formed in the top of the rail car, a bulge portion is formed on the bottom of the hanging plate base, and the hanging plate base is in fixed inserting connection with the rail car through the matching between the bulge portion and the groove. By adopting the design, the volume of the vacuum chamber can be reduced, the vacuum effect is good, the silicon wafers are conveniently picked and placed, residues can be effectively removed from surfaces of the silicon wafers, the silicon wafers can be effectively heated, and film-plated wafers are good in effect.