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A coil potting process
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A coil and potting technology, which is applied in coil manufacturing, non-polymer adhesive additives, adhesive types, etc., can solve problems such as incomplete coil potting, achieve broad market application prospects, improve potting efficiency, and reduce The effect of material cost
Active Publication Date: 2020-06-16
佛山市亨得利电子电器有限公司
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Abstract
Description
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Problems solved by technology
[0003] In order to overcome the above deficiencies or defects in the prior art, the purpose of the present invention is to provide a coil potting process, which can effectively slow down the process of epoxy potting by placing the coil core in a freezer in advance to cool down to 15-20°C. The curing of the glue can solve the problem of incomplete potting of the coil due to the fast curing of the epoxy potting glue; at the same time, the insulating filler is added to the preparation raw materials, which can further slow down the curing speed of the epoxy resin and improve the pouring efficiency. And greatly reduce the cost of materials
Method used
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preparation example Construction
[0023] Preparation of epoxy potting glue: After stirring the epoxy resin with a mass ratio of 3.5-4.5:1 and the curing agent, add 20-25wt% of the total mass of insulating fillers with a density higher than that of the epoxy resin and mix evenly to obtain a ring Oxygen potting glue, spare;
[0024] Installation: put the pretreated coil core into the coil box;
[0025] Potting: pour the prepared epoxy potting glue into the above coil box;
[0026] Curing and separation: After the epoxy potting glue is cured, the potted coil core is separated from the coil box to obtain the finished potted coil.
[0027] Further, vacuumize the coil box before or after pouring the potting material.
[0028] Furthermore, the insulating filler is one or more of quartz sand, fine aggregate, coarse aggregate or glass flakes.
[0029] Further, the curing agent used in the epoxy bonding adhesive is a low-temperature curing agent.
[0030] Further, the low-temperature curing agent is polythiol type o...
Embodiment 1
[0036] A potting process of a coil in the present invention comprises the following steps:
[0037] Coil core pretreatment: place the coil core in a freezer to cool down to 15°C;
[0038] Preparation of epoxy potting glue: After stirring the epoxy resin and curing agent with a mass ratio of 3.5:1, add 20 wt% of the total mass of quartz sand sieved through a screen with a 200-mesh aperture and mix evenly to obtain Epoxy potting glue, spare;
[0039] Installation: put the pretreated coil core into the coil box;
[0040] Potting: After vacuuming the coil box, pour the prepared epoxy potting glue into the coil box, and pour it inward along multiple directions of the coil core at the same time;
[0041] Curing and separation: After the epoxy potting glue is cured, the potted coil is separated from the coil box, and the potted coil finished product 1 is obtained.
Embodiment 2
[0043] A potting process of a coil in the present invention comprises the following steps:
[0044] Coil core pretreatment: place the coil core in a freezer to cool down to 20°C;
[0045] Preparation of epoxy potting glue: After stirring the epoxy resin and curing agent with a mass ratio of 4.5:1, add 25 wt% of the total mass of quartz sand sieved through a screen with a 200-mesh aperture and mix evenly to obtain Epoxy potting glue, spare;
[0046] Installation: put the pretreated coil core into the coil box;
[0047] Potting: After vacuuming the coil box, pour the prepared epoxy potting glue into the coil box, and pour it inward along multiple directions of the coil core at the same time;
[0048] Curing and separation: After the epoxy potting glue is cured, the potted coil is separated from the coil box, and the potted coil product 2 is obtained.
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PUM
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Abstract
The invention relates to the technical field of embedding, and specifically relates to an embedding technology of coils. The embedding technology of coils includes the steps: pretreatment of a coil core, and preparation, installation, embedding, solidification and separating of epoxycasting glue, wherein for pretreatment of the coil core, freezing the coil core to 15-20DEG C in advance, so as toeffectively alleviate solidification of the epoxycasting glue to solve the problem that glues pouring of the coil is not thorough because solidification of the epoxycasting glue is too quick so as to effectively avoid appearance of multiple bubbles and embedding leakage phenomenon; and blending the preparation raw material with insulation filling material, so that natural sedimentation of the insulation filling material can effectively extrude the bubbles in the epoxy resin so as to further alleviate the solidification speed of the epoxy resin to improve the embedding efficiency, and at thesame time the material cost is greatly reduced because of adding of the cheap insulation filling material. The embedding technology of coils has the advantages of effectively avoiding the potential safety hazard, prolonging the service life of coils, being a practicable embedding technology of coils, being suitable for large scale production, and having a wide market application prospect.
Description
technical field [0001] The invention relates to the technical field of potting, in particular to a coil potting process. Background technique [0002] The coil is directly exposed to the air for a long time, it is not easy to resist acid and alkali, and the water, oil, dust in the air can easily cause the coil to age and oxidize, which may bring safety hazards and greatly shorten the service life of the coil, so people Epoxypotting glue is often used to pot the conductive coil to isolate the air, so as to achieve the purpose of moisture-proof, waterproof, oil-proof, dust-proof, heat-resistant and atmospheric aging. The commonly used epoxy potting glue is a type of epoxy resin liquid packaging or potting material made of epoxy resin as the main component, adding various functional additives, and matching with a suitable curing agent. However, in practical applications, the higher the temperature in the production environment, the faster the curing speed of the epoxy potting...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Application Information
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