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A coil potting process

A coil and potting technology, which is applied in the manufacture of coils, electrical components, inductors/transformers/magnets, etc., can solve the problems of too fast curing of epoxy potting glue and incomplete potting of coils, etc., and achieve broad market application prospects , Moisture-proof, water-proof, oil-proof and dust-proof performance, good resistance to humidity, heat and atmospheric aging

Active Publication Date: 2020-09-01
佛山市亨得利电子电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the above deficiencies or defects in the prior art, the purpose of the present invention is to provide a coil potting process, by placing the coil core in the freezer in advance to cool down to 15-20 ° C, to effectively slow down the process of epoxy potting The curing of the glue, in order to solve the problem of incomplete potting of the coil due to the high temperature in the production environment that makes the epoxy potting glue cure too fast, so as to effectively avoid the phenomenon of more air bubbles and leakage of potting after potting, fundamentally to isolate the coil from the air

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0019] Preparation of epoxy potting glue: Stir the epoxy resin and curing agent, and after uniform mixing, get the epoxy potting glue, set aside;

[0020] Installation: put the pretreated coil core into the coil box;

[0021] Potting: pour the prepared epoxy potting glue into the above coil box;

[0022] Curing and separation: After the epoxy potting glue is cured, the potted coil core is separated from the coil box to obtain the finished potted coil.

[0023] Further, in the preparation of epoxy potting glue, the mass ratio of the epoxy resin to the curing agent is 3.5-4.5:1, which can ensure that there is enough curing agent to make the epoxy resin cure successfully and meet the hardness requirements, and It can avoid the phenomenon that the epoxy resin cures too slowly or even does not cure due to too little curing agent content.

[0024] Further, vacuumize the coil box before or after pouring the epoxy potting compound. Further, the curing agent used in the epoxy bondin...

Embodiment 1

[0029] A potting process of a coil in the present invention comprises the following steps:

[0030] Coil core pretreatment: place the coil core in a freezer to cool down to 15°C;

[0031] Preparation of epoxy potting glue: Stir the epoxy resin with a mass ratio of 3.5:1 and the polymercaptan type curing agent, after uniform mixing, obtain milky white epoxy potting glue, set aside;

[0032] Installation: put the pretreated coil core into the coil box;

[0033] Potting: After vacuuming the coil box, pour the prepared epoxy potting glue into the coil box, and pour it inward along multiple directions of the coil core at the same time;

[0034] Curing and separation: After the epoxy potting glue is cured, the potted coil is separated from the coil box, and the potted coil finished product 1 is obtained.

Embodiment 2

[0036] A potting process of a coil in the present invention comprises the following steps:

[0037] Coil core pretreatment: place the coil core in a freezer to cool down to 20°C;

[0038] Preparation of epoxy potting glue: Stir the epoxy resin with a mass ratio of 4.5:1 and the polyisocyanate curing agent, and mix evenly to obtain milky white epoxy potting glue, which is set aside;

[0039] Installation: put the pretreated coil core into the coil box;

[0040] Potting: After vacuuming the coil box, pour the prepared epoxy potting glue into the coil box, and pour it inward along multiple directions of the coil core at the same time;

[0041] Curing and separation: After the epoxy potting glue is cured, the potted coil is separated from the coil box, and the potted coil product 2 is obtained.

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PUM

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Abstract

The invention relates to the technical field of potting, and particularly provides a potting technology of a coil. The technology comprises the steps of coil core pretreatment, epoxy resin pouring sealant preparation, installation, potting, solidification and separation, wherein the step of coil core pretreatment can effectively retard the solidification of the epoxy resin pouring sealant by freezing the coil core to 15-20 DEG C in advance so as to the solve the problem of incomplete coil potting caused by too quick epoxy resin pouring sealant solidification, thereby effectively avoiding morebubbles and a can leaking phenomenon during pouring. The potting technology of the coil has the advantages that the prepared potting coil finished product is poured completely, no bubble exists, the surface is flat, the gloss is good, the product has acid and alkali resistance, the performance of moisture prevention, water prevention, grease prevention and dust prevention is excellent, the producthas damp heat resistance and atmospheric aging resistance, and the hardness of the product is higher after solidification; potential safety hazards are skillfully avoided, thereby indirectly prolonging the service life of the coil, the potting technology of the coil is feasible and can be suitable for large-scale production, and has a wide market application prospect.

Description

technical field [0001] The invention relates to the technical field of potting, in particular to a coil potting process. Background technique [0002] The coil is directly exposed to the air for a long time, it is not easy to resist acid and alkali, and the water, oil, dust in the air can easily cause the coil to age and oxidize, which may bring safety hazards and greatly shorten the service life of the coil, so people Epoxy potting glue is often used to pot the conductive coil to isolate the air, so as to achieve the purpose of moisture-proof, waterproof, oil-proof, dust-proof, heat-resistant and atmospheric aging. The commonly used epoxy potting glue is a type of epoxy resin liquid packaging or potting material made of epoxy resin as the main component, adding various functional additives, and matching with a suitable curing agent. However, in practical applications, the higher the temperature in the production environment, the faster the curing speed of the epoxy potting...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F41/04H01F41/12
CPCH01F41/04H01F41/127
Inventor 庞铿庞泽新庞毅
Owner 佛山市亨得利电子电器有限公司