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Porous semiconductor manufacturing equipment with high productivity

A high-productivity, equipment-manufacturing technology, applied in the direction of manufacturing tools, stone processing equipment, work accessories, etc., can solve the problems of inaccurate drilling, untimely processing, low productivity and waste residue, etc., to achieve convenient use and improve the accuracy of drilling Effect

Inactive Publication Date: 2018-08-21
连雪琼
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing technology is generally not accurate enough to drill holes, the productivity is low, and the waste residue is not processed in time to affect the quality of semiconductors. This function can be further improved.

Method used

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  • Porous semiconductor manufacturing equipment with high productivity
  • Porous semiconductor manufacturing equipment with high productivity
  • Porous semiconductor manufacturing equipment with high productivity

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Effect test

Embodiment

[0026] see Figure 1-Figure 4 , the present invention provides a high-productivity porous semiconductor manufacturing equipment: its structure includes a hinge 1, a heat dissipation hole 2, a manufacturing box 3, a bracket 4, a display screen 5, an observation platform 6, a precise punching mechanism 7, a product identification 8, Handle 9, open and close door 10;

[0027] The hinge 1 is arranged between the opening and closing door 10 and the manufacturing box 3 and is hingedly connected. The heat dissipation hole 2 is embedded in the lower right side of the manufacturing box 3 and is fixedly connected to form an integrated structure. The manufacturing box 3 It is a cuboid structure and the lower part is provided with an opening and closing door 10. The bracket 4 is welded between the top of the manufacturing box 3 and the display screen 5 and is perpendicular to the manufacturing box 3. The display screen 5 is arranged on the manufacturing box through the bracket 4. The top...

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PUM

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Abstract

The invention discloses porous semiconductor manufacturing equipment with high productivity. The porous semiconductor manufacturing equipment structurally comprises hinges, radiating holes, a manufacturing box body, a bracket, a display screen, an observation table, an accurate punching mechanism, a product mark, a handle and an opening-closing door. The hinges are arranged between the opening-closing door and the manufacturing box body in an articulated connection manner, the radiating holes are embedded in the lower right part of the manufacturing box body and fixedly connected to form an integrated structure, the manufacturing box body is of a cuboid structure, the lower part of the manufacturing box is provided with the opening-closing door, and the bracket is welded between the top ofthe manufacturing box body and the display screen and is perpendicular to the manufacturing box body. According to the porous semiconductor manufacturing equipment, by touching an opening-closing rodstart switch, an adsorption fixing seat and a punch are mutually parallel and play the role of limiting position clamping, and waste can directly fall into an adsorption seat while the punching accuracy rate can be increased; and when the adsorption seat is leftward in press connection with a pump, the pump is started to absorb and discharges impurities in a tank, so that the cleanliness in the equipment can be maintained, the semiconductor manufacturing quality can be guaranteed and the use is convenient.

Description

technical field [0001] The invention is a high-productivity porous semiconductor manufacturing equipment, which belongs to the field of high-productivity porous semiconductor manufacturing equipment. Background technique [0002] Crystalline silicon is the most dominant absorber material in commercial photovoltaic applications. The higher efficiencies and material abundance associated with the mass production of crystalline silicon solar cells have attracted their continued use and improvement. But the relatively high cost of the crystalline silicon material itself limits the widespread use of these solar modules. Currently, the cost of “wafers” or crystalline silicon and slices accounts for about 40%-60% of the manufacturing cost of finished solar modules. If there were a more direct way to make wafers, it would be a huge step forward in reducing the cost of solar cells. Different methods of growing single crystal silicon and releasing or transferring the grown wafer are...

Claims

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Application Information

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IPC IPC(8): B28D5/02B28D7/00B28D7/02
CPCB28D5/021B28D5/0058B28D5/0076
Inventor 连雪琼
Owner 连雪琼