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Semiconductor device with interdigitated electrodes

A semiconductor and interdigitated technology, which is applied in the field of semiconductor devices with interdigitated electrodes, can solve the problems of high electric field cannot be extended, high electric field exists, low breakdown voltage, etc., and achieve the effect of good chip scale and chip scale control

Active Publication Date: 2022-06-21
苏州量芯微半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, we will show that there are limitations to this design, such as the presence of high electric fields at the corners that cannot extend to other parts of the fingers
In addition, due to uneven current or electric field distribution, the existing electrode layout designs basically have potential defects of high on-resistance or low breakdown voltage.

Method used

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  • Semiconductor device with interdigitated electrodes
  • Semiconductor device with interdigitated electrodes
  • Semiconductor device with interdigitated electrodes

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Embodiment Construction

[0032] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.

[0033] Unless expressly stated otherwise, throughout the specification and claims, the term "comprising" or its conjugations such as "comprising" or "comprising" and the like will be understood to include the stated elements or components, and Other elements or other components are not excluded.

[0034] figure 1 It is a schematic diagram of the interdigital electrode in the prior art. The semiconductor device includes a drain (D), a source (S), a drain electrode substrate 11 and a source electrode substrate 12, and interdigitated electrodes are arranged between the drain and the source. As can be seen from the figure, the interdigitated electrodes in the prior art are all regular rectangular interdigital fingers, and ...

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Abstract

Disclosed is a semiconductor device having interdigitated electrodes, the semiconductor device including a drain, a source, and a plurality of interdigitated electrodes, each of the plurality of interdigitated electrodes has a Two interdigitated fingers of the source substrate, with at least one semiconductor conductive region between any two interdigitated electrodes in the plurality of interdigitated electrodes, wherein the interdigitated shape is an asymmetric shape and the fingertips of the interdigitated shape is a non-linear shape. Using the interdigitated electrode of the present invention can make the current or power evenly distributed on the entire chip surface, and the interdigitated electrode of the present invention has an electrode base with variable width, thereby realizing effective control of the flow distribution on the metal and good control chip scale.

Description

technical field [0001] The present invention relates to a semiconductor device, in particular to a semiconductor device with interdigitated electrodes. Background technique [0002] In recent years, with the development of semiconductor technology, third-generation semiconductor materials such as GaN, AlGaN and other new materials have gradually attracted widespread attention. Due to their wide band gap and the ability to form a two-dimensional electron gas (2DEG) at the AlGaN / GaN heterojunction interface, these novel semiconductor materials have been widely used to fabricate high electron mobility transistors (HEMTs), extremely The conversion and conduction efficiency of the device is greatly improved. These devices are typically lateral devices, where current can flow close to the surface. [0003] In order to realize a variety of power electronic applications, semiconductor devices are generally required to be capable of current input of 1 to 100 amps. In lateral semic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/41H01L29/778
CPCH01L29/41H01L29/778H01L29/401H01L31/1085H01L33/20H01L31/022408H01L33/38H01L29/41758H01L29/7786
Inventor 李湛明傅玥吴卫东刘雁飞
Owner 苏州量芯微半导体有限公司
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