Ultra-large width three-dimensional laser engraving method and system

Abstract

The invention relates to an ultra-large width three-dimensional laser engraving method and system. The ultra-large width three-dimensional laser engraving method comprises the steps that a laser control system acquires three-dimensional data of an object to be engraved or a target model and laser engraving parameters, wherein the laser engraving parameters include the speed parameter; bearing platform movement parameters are calculated according to the laser engraving parameters, wherein the bearing platform movement parameters include the bearing platform moving speed and the step pitch; andthe laser control system is started to carry out laser engraving, and based on the bearing platform movement parameters, the bearing platform is controlled to move so that the scanning head width of the laser control system covers laser processing lines or a processing face of the object to be engraved or the target model all the time. According to the ultra-large width three-dimensional laser engraving method and system, due to the fact that the object to be engraved and a laser running track are linked, continuous laser outlet processing of laser is kept all the time, all the processing lines are not disconnected, the joint problem caused by splicing is avoided, finally a smooth and complete processing surface is obtained, and higher-precision ultra-large width three-dimensional laser engraving is achieved.

Description

technical field [0001] The invention belongs to the technical field of laser three-dimensional marking, and in particular relates to a super large format three-dimensional laser engraving method and system. Background technique [0002] With the rapid development of laser application technology, the application range of industrial laser is becoming wider and wider. Laser marking, laser cutting, laser welding, etc. are all mature and extensive application processes, and are widely used in industrial processing in various industries. With the continuous upgrading of the industry and the continuous development of optoelectronic technology, the application range of 3D laser marking technology is becoming wider and wider, and the precision requirements are getting higher and higher. [0003] Three-dimensional laser marking processing is based on traditional numerical control technology, uses laser as the processing medium, irradiates the controllable laser on the processed materi...

AI Technical Summary

Problems solved by technology

[0004] In the existing industrial laser applications, the control of the laser is achieved through the laser scanning head and the F-Theta field lens to achieve positioning and focusing. Therefore, the final laser processing format has certain limitations. When faced with ultra-length processing requirements, The usual practice is to use the splicing method to achieve larger-format laser processing, that is, through the moving stage processing, that is, laser engraving is carried out within the range of the laser scanning head first, then the laser is stopped, the stage is moved, and then the laser engraving is carried out. At the end of the second marking, the engraving of the next format unit is carried out until the entire object is carved. In this processing method, there will be obvious seam marks at the joints of the two formats, and a smooth and complete processing surface cannot be achieved. Unable to meet demands with higher requirements on surface smoothness

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