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Bearing device and process chamber

A technology for carrying devices and workpieces, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of high thermal conductivity, poor temperature uniformity of processed workpieces, and poor process uniformity, so as to improve temperature uniformity, improve Process uniformity, the effect of improving uniformity

Active Publication Date: 2018-08-28
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In practical applications, since the ring-shaped edge area 3 is in closer contact with the processed workpiece than the central area 4, and the width of the ring-shaped edge area 3 is generally about 5mm, which is relatively wide to ensure a better sealing effect, therefore, The thermal conductivity of the annular edge area 3 is higher than that of the central area 4; in addition, since the area where the annular gas groove 2 is located is not in contact with the central area 4 and the workpiece to be processed, and the width of the annular gas groove 2 is generally about 2mm , the depth is about 50 μm, which makes the thermal conductivity of the area where the annular gas groove 2 is located is lower than that of the central area 4
[0005] Based on the above analysis, it can be seen that the thermal conductivity of the annular edge area 3 is greater than that of the central area 4, and the thermal conductivity of the central area 4 is greater than that of the area where the annular gas groove 2 is located. Therefore, the existing carrying device will cause the load to be carried. The temperature uniformity of the processed workpiece is poor, resulting in poor process uniformity

Method used

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  • Bearing device and process chamber
  • Bearing device and process chamber
  • Bearing device and process chamber

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] figure 2 A longitudinal sectional view of a carrying device provided by an embodiment of the present invention; image 3 A transverse cross-sectional view of a carrying device provided by an embodiment of the present invention; Figure 4 for figure 2 Partial enlarged view of area A in the middle; Figure 5 for figure 2 A partial large image of area B in the middle. Please also refer to Figure 2 to Figure 5 The carrying device provided by the embodiment of the present invention includes a workpiece for carrying and fixing a wafer to be processed. The carrying device includes a conductive layer 20 and an insulating layer 10 stacked on the conductive layer 20. The insulating layer 10 includes a central body 101, an annular Edge body 102 and groove body 103 . Wherein, a recess is provided on the upper surface of the central body 101 to place the groove body 103; the groove body 103 is provided with a gas groove 1031 for connecting with a gas source (not shown in t...

Embodiment 2

[0055] The embodiment of the present invention also provides a process chamber, in which a carrying device is provided for carrying and fixing the workpiece to be processed. The carrying device adopts the carrying device provided in the above-mentioned embodiment 1 of the present invention.

[0056] Specifically, the process chamber includes but not limited to an etching chamber.

[0057] The process chamber provided in the embodiment of the present invention can improve process uniformity because it adopts the carrying device provided in Embodiment 1 of the present invention.

Embodiment 3

[0059] The embodiment of the present invention also provides a method for preparing the carrying device provided in the above-mentioned embodiment 1. The preparation of the insulating layer includes the following steps:

[0060] The central body is prepared by sintering.

[0061] The annular edge body is prepared by spraying, and the annular edge body is arranged around the side wall of the central body.

[0062] The groove body is prepared by spraying, and the groove body is arranged in the concave portion of the central body.

[0063] The preparation method of the carrying device provided in the embodiment of the present invention has a simple preparation process and is easy to operate.

[0064] Preferably, the method further includes: adopting a grinding method to make the roughness of the upper surface of the annular edge body smaller than the roughness of the upper surface of the central body.

[0065] Specifically, when the peripheral edge of the central body 101 of th...

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Abstract

The invention provides a bearing device which is used for bearing and fixing a processed workpiece. The bearing device comprises a conductive layer and an insulating layer which is superposed on the conductive layer. The insulating layer comprises a central member, an annular edge member and groove members. The upper surface of the central member is provided with a recessed part for placing the groove member. The groove member is provided with a gas groove which is used for connecting with an air source. The annular edge member is arranged in a manner of surrounding the side wall of the central member. The heat conductivity of the annular edge member is lower than that of the central member, and / or the heat conductivity of the center member is lower than the heat conductivity of the groovemember. The invention further provides a process chamber with the bearing device according to the invention. The bearing device and the process chamber according to the invention can improve temperature homogeneity of the processed workpiece, thereby improving process uniformity (such as etching uniformity).

Description

technical field [0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a carrying device and a process chamber. Background technique [0002] In the integrated circuit (IC) manufacturing process, especially in plasma etching (ETCH), physical vapor deposition (PVD), chemical vapor deposition (CVD) and other processes, such as electrostatic chuck (ESC) is often used The carrier device is used to fix, support and transfer the processed workpiece (Wafer) and realize temperature control to avoid movement or misalignment during the process. Electrostatic chucks use electrostatic attraction to fix workpieces, including Coulomb and Johnson-Rahbek types. Compared with other fixing methods, electrostatic chucks have the following advantages: First, it can avoid irreparable damage to workpieces caused by mechanical reasons. Second, it can increase the effective processing area of ​​the processed workpiece; third, it can reduce the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/687
CPCH01L21/6833H01L21/68757
Inventor 王伟
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD